Invention Grant
- Patent Title: Compliant micro device transfer head
- Patent Title (中): 符合微器件传输头
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Application No.: US13466966Application Date: 2012-05-08
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Publication No.: US09105492B2Publication Date: 2015-08-11
- Inventor: Andreas Bibl , John A. Higginson , Hsin-Hua Hu
- Applicant: Andreas Bibl , John A. Higginson , Hsin-Hua Hu
- Applicant Address: US CA Santa Clara
- Assignee: LuxVue Technology Corporation
- Current Assignee: LuxVue Technology Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: G01P15/125
- IPC: G01P15/125 ; H01L25/075 ; H01L21/67 ; H01L33/00
Abstract:
A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.
Public/Granted literature
- US20130300812A1 COMPLIANT MICRO DEVICE TRANSFER HEAD Public/Granted day:2013-11-14
Information query
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