Invention Grant
US09105648B2 Adhesive and method of encapsulating organic electronic device using the same
有权
粘合剂和使用其的封装有机电子器件的方法
- Patent Title: Adhesive and method of encapsulating organic electronic device using the same
- Patent Title (中): 粘合剂和使用其的封装有机电子器件的方法
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Application No.: US14289212Application Date: 2014-05-28
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Publication No.: US09105648B2Publication Date: 2015-08-11
- Inventor: Hyun Jee Yoo , Yoon Gyung Cho , Jung Sup Shim , Suk Chin Lee , Kwang Jin Jeong , Suk Ky Chang
- Applicant: LG Chem, Ltd.
- Applicant Address: KR Seoul
- Assignee: LG Chem, Ltd.
- Current Assignee: LG Chem, Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge, LLP
- Priority: KR10-2010-0108113 20101102; KR10-2011-0004054 20110114; KR10-2011-0113121 20111102
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L35/24 ; H01L51/00 ; H01L23/00 ; H01L51/52 ; H05B33/04 ; H01L51/56 ; C09J7/00 ; C09J7/02 ; H01L21/56 ; H01L23/28 ; H01L23/29 ; C08K3/22 ; C08K3/34 ; C08K3/36 ; C09J163/00 ; C08K3/16
Abstract:
An adhesive, and an encapsulated product and method of encapsulating an organic electronic device (OED) using the same are provided. The adhesive film serves to encapsulate the OED and includes a curable resin and a moisture absorbent, and the adhesive includes a first region coming in contact with the OED upon encapsulation of the OED and a second region not coming in contact with the OED. Also, the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive.
Public/Granted literature
- US20140264302A1 ADHESIVE AND METHOD OF ENCAPSULATING ORGANIC ELECTRONIC DEVICE USING THE SAME Public/Granted day:2014-09-18
Information query
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