Invention Grant
- Patent Title: Nonvolatile semiconductor device and method of manufacturing the same
- Patent Title (中): 非易失性半导体器件及其制造方法
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Application No.: US14325472Application Date: 2014-07-08
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Publication No.: US09117849B2Publication Date: 2015-08-25
- Inventor: Kenichi Akita , Daisuke Okada , Keisuke Kuwahara , Yasufumi Morimoto , Yasuhiro Shimamoto , Kan Yasui , Tsuyoshi Arigane , Tetsuya Ishimaru
- Applicant: RENESAS ELECTRONICS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kanagawa
- Agency: Mattingly & Malur, PC
- Priority: JP2007-218147 20070824
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/66 ; H01L27/115 ; H01L29/792

Abstract:
A method and apparatus of forming a nonvolatile semiconductor device including forming a first gate insulating film on a main surface of a first semiconductor region, forming a first gate electrode on the first gate insulating film, forming a second gate insulating film, forming a second gate electrode over a first side surface of the first gate electrode, selectively removing the second gate insulating film, etching the second gate insulating film kept between the second gate electrode and a main surface of the first semiconductor region in order to form an etched charge storage layer, introducing first impurities in the first semiconductor region in a self-aligned manner to the second gate electrode in order to form a second semiconductor region, annealing the semiconductor substrate to extend the second semiconductor region to an area under the second gate electrode.
Public/Granted literature
- US20140322874A1 NONVOLATILE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2014-10-30
Information query
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