发明授权
- 专利标题： Method and apparatus for plating solution analysis and control
- 专利标题（中）： 电镀液分析与控制方法及装置
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申请号： US12333893申请日： 2008-12-12
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公开(公告)号： US09128493B2公开(公告)日： 2015-09-08
- 发明人: Ron Rulkens , Nanhai Li , Artur Kolics , Aman Jain , Darin Birtwhistle , Chee Chan
- 申请人： Ron Rulkens , Nanhai Li , Artur Kolics , Aman Jain , Darin Birtwhistle , Chee Chan
- 申请人地址： US CA Fremont
- 专利权人： Lam Research Corporation
- 当前专利权人： Lam Research Corporation
- 当前专利权人地址： US CA Fremont
- 代理机构： Beyer Law Group LLP
- 主分类号： G01N21/00
- IPC分类号： G01N21/00 ; G05D11/13 ; C25D21/12 ; C25D21/14 ; G01N21/31 ; G01N21/65 ; G01N21/85 ; G01N21/84
摘要：
A plating system comprises a plating solution and an apparatus for control of the plating solution, the apparatus including a Raman spectrometer for measurement of organic components, a visible light spectrometer for measurement of metallic components, and a pH probe. The plating solution can be sampled continuously or at intervals. Dosing of the plating solution adjusts for components consumed or lost in the plating process. The method of dosing is based on maintaining a desired composition of the plating solution.
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