Invention Grant
- Patent Title: Method of preparing porous metal material
- Patent Title (中): 多孔金属材料的制备方法
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Application No.: US14055300Application Date: 2013-10-16
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Publication No.: US09129755B2Publication Date: 2015-09-08
- Inventor: No-kyoung Park , Jae-hyun Hur , Kyu-hyun Im
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2012-0114760 20121016
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G11/30 ; B01J31/28 ; H01G11/86 ; H01M4/38 ; B01J31/06 ; H01M4/90 ; H01M4/92 ; B01J37/16 ; B01J37/32 ; B01J23/42 ; B01J23/44 ; B01J23/52
Abstract:
Provided is a method of preparing a porous metal material. The method includes: obtaining a composite of a DNA hydrogel and a metal precursor by mixing the DNA hydrogel and the metal precursor; and reducing the composite of the DNA hydrogel and the metal precursor.
Public/Granted literature
- US20140104753A1 METHOD OF PREPARING POROUS METAL MATERIAL Public/Granted day:2014-04-17
Information query
