Invention Grant
- Patent Title: System for testing semiconductor modules
- Patent Title (中): 半导体模块测试系统
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Application No.: US14024364Application Date: 2013-09-11
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Publication No.: US09134365B2Publication Date: 2015-09-15
- Inventor: Min-Woo Kim , Bae-Ki Lee , Young-Soo Lee , Hyung-Yun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Onello & Mello, LLP.
- Priority: KR10-2012-0145862 20121214
- Main IPC: B07C5/08
- IPC: B07C5/08 ; G01R31/28 ; G01R31/26 ; G01R31/18

Abstract:
A system for testing semiconductor modules may include a first testing unit, a second testing unit, a classifying unit and a transferring unit. The first testing unit may test functions of the semiconductor modules mounted on a main board. The second testing unit may test the semiconductor modules tested by the first testing unit using a terminal. The classifying unit may classify the semiconductor modules tested by the second testing unit into normal semiconductor modules and abnormal semiconductor modules, or pass/fail. The transferring unit may be connected in-line between the first testing unit and the second testing unit, and between the second testing unit and the classifying unit to transfer the semiconductor modules from the first testing unit to the second testing unit and the classifying unit. Thus, the semiconductor modules may be automatically transferred to the units, so that a test time may be reduced.
Public/Granted literature
- US20140166544A1 SYSTEM FOR TESTING SEMICONDUCTOR MODULES Public/Granted day:2014-06-19
Information query
IPC分类: