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    TEST CHAMBER FOR MEMORY DEVICE, TEST SYSTEM FOR MEMORY DEVICE HAVING THE SAME AND METHOD OF TESTING MEMORY DEVICES USING THE SAME
    2.
    发明申请
    TEST CHAMBER FOR MEMORY DEVICE, TEST SYSTEM FOR MEMORY DEVICE HAVING THE SAME AND METHOD OF TESTING MEMORY DEVICES USING THE SAME 审中-公开

    公开(公告)号：US20190285695A1

    公开(公告)日：2019-09-19

    申请号：US16182148

    申请日：2018-11-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Woo Kim ,  Chang-ho Lee ,  Jin-Ho Choi

    IPC: G01R31/28

    Abstract: A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.

    Test chamber for memory device, test system for memory device having the same and method of testing memory devices using the same
    3.
    发明授权
    Test chamber for memory device, test system for memory device having the same and method of testing memory devices using the same 有权

    公开(公告)号：US11255904B2

    公开(公告)日：2022-02-22

    申请号：US17031390

    申请日：2020-09-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Woo Kim ,  Chang-Ho Lee ,  Jin-Ho Choi

    IPC: G01R31/28

    Abstract: A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.

    Test chamber for memory device, test system for memory device having the same and method of testing memory devices using the same
    4.
    发明授权
    Test chamber for memory device, test system for memory device having the same and method of testing memory devices using the same 有权

    公开(公告)号：US10816596B2

    公开(公告)日：2020-10-27

    申请号：US16182148

    申请日：2018-11-06

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Woo Kim ,  Chang-Ho Lee ,  Jin-Ho Choi

    IPC: G01R31/28

    Abstract: A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.

    System for testing semiconductor modules
    6.
    发明授权
    System for testing semiconductor modules 有权
    半导体模块测试系统

    公开(公告)号：US09134365B2

    公开(公告)日：2015-09-15

    申请号：US14024364

    申请日：2013-09-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Woo Kim ,  Bae-Ki Lee ,  Young-Soo Lee ,  Hyung-Yun Lee

    IPC: B07C5/08 ,  G01R31/28 ,  G01R31/26 ,  G01R31/18

    CPC classification number: G01R31/2868 ,  G01R31/18 ,  G01R31/26 ,  G01R31/2601 ,  G01R31/2806 ,  G01R31/2893

    Abstract: A system for testing semiconductor modules may include a first testing unit, a second testing unit, a classifying unit and a transferring unit. The first testing unit may test functions of the semiconductor modules mounted on a main board. The second testing unit may test the semiconductor modules tested by the first testing unit using a terminal. The classifying unit may classify the semiconductor modules tested by the second testing unit into normal semiconductor modules and abnormal semiconductor modules, or pass/fail. The transferring unit may be connected in-line between the first testing unit and the second testing unit, and between the second testing unit and the classifying unit to transfer the semiconductor modules from the first testing unit to the second testing unit and the classifying unit. Thus, the semiconductor modules may be automatically transferred to the units, so that a test time may be reduced.

    Abstract translation: 用于测试半导体模块的系统可以包括第一测试单元，第二测试单元，分类单元和传送单元。 第一测试单元可以测试安装在主板上的半导体模块的功能。 第二测试单元可以使用终端来测试由第一测试单元测试的半导体模块。 分类单元可以将由第二测试单元测试的半导体模块分类为正常半导体模块和异常半导体模块，或者通过/失败。 传送单元可以在第一测试单元和第二测试单元之间以及第二测试单元与分类单元之间的串联连接，以将半导体模块从第一测试单元传送到第二测试单元和分类单元。 因此，可以将半导体模块自动转移到单元，从而可以减少测试时间。

    Universal flash storage memory card
    7.
    发明授权
    Universal flash storage memory card 有权

    公开(公告)号：US11307637B2

    公开(公告)日：2022-04-19

    申请号：US16931940

    申请日：2020-07-17

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： In-Jae Lee ,  Min-Woo Kim ,  Seung Wan Koh

    IPC: G06F1/3234 ,  G06F1/04 ,  G06F13/16 ,  H01R12/72

    Abstract: A memory card includes a first ground terminal arranged in a first row that provides a ground voltage to at least one nonvolatile memory or a memory controller, universal flash storage (UFS) terminals arranged in a second row including a first UFS terminal that provides a second power, a second UFS terminal that provides a reference clock signal, and a third UFS terminal that provides a path for input/output data to the memory controller, and a first power terminal arranged in a third row that provides a first power supply voltage (VCC) to the at least one nonvolatile memory or the memory controller. The memory card has a size defined by a nano subscriber identification module (SIM) card standard, the first ground terminal corresponds to a “C5” terminal of the nano SIM card standard, and the first power terminal corresponds to a “C1” terminal of the nano SIM card standard.

    TEST CHAMBER FOR MEMORY DEVICE, TEST SYSTEM FOR MEMORY DEVICE HAVING THE SAME AND METHOD OF TESTING MEMORY DEVICES USING THE SAME
    8.
    发明申请
    TEST CHAMBER FOR MEMORY DEVICE, TEST SYSTEM FOR MEMORY DEVICE HAVING THE SAME AND METHOD OF TESTING MEMORY DEVICES USING THE SAME 有权

    公开(公告)号：US20210003632A1

    公开(公告)日：2021-01-07

    申请号：US17031390

    申请日：2020-09-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Min-Woo Kim ,  Chang-Ho Lee ,  Jin-Ho Choi

    IPC: G01R31/28

    Abstract: A test system for a memory device includes: a chamber including at least one test socket column having a plurality of test sockets arranged in a first direction, wherein memory devices to be tested are in respective ones of the plurality of test sockets, a temperature adjusting apparatus configured to supply air into the chamber according to a temperature control signal to control a temperature of the chamber, a test device electrically connected to the test sockets and configured to test the memory devices, and a temperature controller configured to receive temperature information of the memory devices from temperature sensors of the memory devices and to output to the temperature adjusting apparatus the temperature control signal to compensate for a temperature difference between a detected temperature of the memory devices and a target temperature.

    APPARATUS FOR TESTING ELECTRONIC DEVICES
    9.
    发明申请
    APPARATUS FOR TESTING ELECTRONIC DEVICES 审中-公开
    用于测试电子设备的装置

    公开(公告)号：US20160139198A1

    公开(公告)日：2016-05-19

    申请号：US14920252

    申请日：2015-10-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bo-Seong Park ,  Joo-In Song ,  Min-Woo Kim ,  Hye-ju Kim ,  Chang-Ho Lee ,  Jong-Hwan Lim

    IPC: G01R31/28 ,  F24F7/08

    CPC classification number: G01R31/2874 ,  G11C29/06 ,  G11C29/56016

    Abstract: An apparatus for testing electronic devices may include a test chamber, a heating unit, a cooling unit and a controller. The test chamber may include a plurality of slots configured to receive the electronic devices. The heating unit may heat the electronic devices in the slots. The cooling unit may individually cool the electronic devices in the slots. The controller may selectively control operations of the heating unit and the cooling unit in accordance with temperatures in the slots. Thus, the electronic devices may be provided with a uniform test temperature so that reliability of test results may be improved.

    Abstract translation: 用于测试电子设备的设备可以包括测试室，加热单元，冷却单元和控制器。 测试室可以包括被配置为接收电子设备的多个狭槽。 加热单元可以加热槽中的电子设备。 冷却单元可以单独地冷却槽中的电子设备。 控制器可以根据槽中的温度选择性地控制加热单元和冷却单元的操作。 因此，电子设备可以具有均匀的测试温度，从而可以提高测试结果的可靠性。

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