Invention Grant
- Patent Title: Solid hole array and method for forming the same
- Patent Title (中): 固体孔阵列及其形成方法
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Application No.: US13697372Application Date: 2012-07-31
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Publication No.: US09136160B2Publication Date: 2015-09-15
- Inventor: Lijun Dong , Chao Zhao
- Applicant: Lijun Dong , Chao Zhao
- Applicant Address: CN
- Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee: INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES
- Current Assignee Address: CN
- Agency: Goodwin Procter LLP
- Priority: CN201210226670 20120629
- International Application: PCT/CN2012/079388 WO 20120731
- International Announcement: WO2014/000332 WO 20140103
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/768 ; H01L23/14 ; H01L21/48

Abstract:
A solid hole array and a method for forming the same are disclosed. The solid hold array may comprise: substrate with a via; a top hole array base formed on a top surface of the substrate and a bottom hole array base formed on a bottom surface of the substrate, wherein a front hole is located in the top hole array base at a place corresponding to the via; and top protection layer formed on a surface and sidewalls of the top hole array base and a bottom protection layer formed on a surface of the bottom hole array base, wherein a rear window is located in the bottom hole array base and the bottom protection layer at a place corresponding to the via.
Public/Granted literature
- US20140001646A1 SOLID HOLE ARRAY AND MANUFACTURE METHOD THEREOF Public/Granted day:2014-01-02
Information query
IPC分类: