Invention Grant
- Patent Title: Polysilicon-based thin film transistor
- Patent Title (中): 基于多晶硅的薄膜晶体管
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Application No.: US13713589Application Date: 2012-12-13
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Publication No.: US09136353B2Publication Date: 2015-09-15
- Inventor: Jun-Hee Choi , Andrei Zoulkarneev
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2007-0003070 20070110
- Main IPC: H01L29/04
- IPC: H01L29/04 ; H01L31/036 ; H01L29/76 ; H01L31/112 ; H01L29/66 ; H01L29/423 ; H01L29/45 ; H01L29/49 ; H01L29/786 ; H01L21/02

Abstract:
A method of forming polysilicon, a thin film transistor (TFT) using the polysilicon, and a method of fabricating the TFT are disclosed. The method of forming the polysilicon comprises: forming an insulating layer on a substrate; forming a first electrode and a second electrode on the insulating layer; forming at least one heater layer on the insulating layer so as to connect the first electrode and the second electrode; forming an amorphous material layer containing silicon on the heater layer(s); forming a through-hole under the heater layer(s) by etching the insulating layer; and crystallizing the amorphous material layer into a polysilicon layer by applying a voltage between the first electrode and the second electrode so as to heat the heater layer(s).
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