Invention Grant
- Patent Title: Semiconductor structure
- Patent Title (中): 半导体结构
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Application No.: US14085939Application Date: 2013-11-21
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Publication No.: US09136375B2Publication Date: 2015-09-15
- Inventor: Chiu-Te Lee , Ming-Shun Hsu , Ke-Feng Lin , Chih-Chung Wang , Hsuan-Po Liao , Shih-Teng Huang , Shu-Wen Lin , Su-Hwa Tsai , Shih-Yin Hsiao
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C.
- Agent Justin King
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/088 ; H01L29/06 ; H01L29/10

Abstract:
A semiconductor structure is provided. The semiconductor structure comprises a substrate, a deep well formed in the substrate, a first well and a second well formed in the deep well, a gate electrode formed on the substrate and disposed between the first well and the second well, a first isolation, and a second isolation. The second well is spaced apart from the first well. The first isolation extends down from the surface of the substrate and is disposed between the gate electrode and the second well. The second isolation extends down from the surface of the substrate and is adjacent to the first well. A ratio of a depth of the first isolation to a depth of the second isolation is smaller than 1.
Public/Granted literature
- US20150137228A1 SEMICONDUCTOR STRUCTURE Public/Granted day:2015-05-21
Information query
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