Invention Grant
- Patent Title: Data center module
- Patent Title (中): 数据中心模块
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Application No.: US13789285Application Date: 2013-03-07
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Publication No.: US09137931B2Publication Date: 2015-09-15
- Inventor: Hsi-Sheng Wu , Hsu-Cheng Chiang , Kuo-Shu Hung , Kuel-Ker Sun
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Rabin & Berdo, P.C.
- Priority: TW099137335A 20101029
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.
Public/Granted literature
- US20130182388A1 DATA CENTER MODULE Public/Granted day:2013-07-18
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