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公开(公告)号:US20170138366A1
公开(公告)日:2017-05-18
申请号:US14991304
申请日:2016-01-08
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Jenn-Chyi Chung , Kun-Yi Liang , Kuo-Shu Hung , Chung-Che Liu , Hsu-Cheng Chiang
CPC classification number: F04D27/0215 , F04D27/0246 , F04D29/083 , F04D29/284 , F04D29/4213 , F04D29/462 , F05D2250/51
Abstract: An internal hot gas bypass device coupled with inlet guide vane for centrifugal compressor includes an inlet guide vane assembly, a driving motor assembly and a gas bypass valve assembly. The inlet guide vane assembly further includes a master vane, a plurality of slave vanes, a vane-front fixing ring, a vane-rear fixing ring, a vane-driving ring, a connecting pipe and a vane-opening indicating disk. The driving motor assembly further includes a motor, a driving unit and a motor fixing base. The gas bypass valve assembly further includes a valve, an external fixing-and-guiding ring, an internal fixing-and-guiding ring, a driven element, a spring, a sealing ring, a valve stud and a valve base. The driving motor assembly is connected with the driving unit and the master vane of the inlet guide vane assembly via a connecting rod, and is further connected with the slave vanes of the gas bypass valve assembly.
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公开(公告)号:US20190154734A1
公开(公告)日:2019-05-23
申请号:US15867802
申请日:2018-01-11
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Bo-Yin Chu , Hsu-Cheng Chiang , Ming-Shan Jeng
IPC: G01R15/18 , G01R21/133 , G01R19/02 , G01R19/175
Abstract: A sensing device includes a housing positioned on an outer surface of a wire and a circuit board received in the housing. The circuit board has a sensing area for sensing the wire, such that the measurements obtained by the circuit board are relative values. Therefore, the circuit design of the circuit board can be simplified, and the size of the sensing device can be reduced.
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公开(公告)号:US10481180B2
公开(公告)日:2019-11-19
申请号:US15867802
申请日:2018-01-11
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Bo-Yin Chu , Hsu-Cheng Chiang , Ming-Shan Jeng
IPC: G01R15/18 , G01R19/175 , G01R19/02 , G01R21/133
Abstract: A sensing device includes a housing positioned on an outer surface of a wire and a circuit board received in the housing. The circuit board has a sensing area for sensing the wire, such that the measurements obtained by the circuit board are relative values. Therefore, the circuit design of the circuit board can be simplified, and the size of the sensing device can be reduced.
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公开(公告)号:US10208758B2
公开(公告)日:2019-02-19
申请号:US14991304
申请日:2016-01-08
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Jenn-Chyi Chung , Kun-Yi Liang , Kuo-Shu Hung , Chung-Che Liu , Hsu-Cheng Chiang
Abstract: An internal hot gas bypass device coupled with inlet guide vane for centrifugal compressor includes an inlet guide vane assembly, a driving motor assembly and a gas bypass valve assembly. The inlet guide vane assembly further includes a master vane, a plurality of slave vanes, a vane-front fixing ring, a vane-rear fixing ring, a vane-driving ring, a connecting pipe and a vane-opening indicating disk. The driving motor assembly further includes a motor, a driving unit and a motor fixing base. The gas bypass valve assembly further includes a valve, an external fixing-and-guiding ring, an internal fixing-and-guiding ring, a driven element, a spring, a sealing ring, a valve stud and a valve base. The driving motor assembly is connected with the driving unit and the master vane of the inlet guide vane assembly via a connecting rod, and is further connected with the slave vanes of the gas bypass valve assembly.
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公开(公告)号:US09137931B2
公开(公告)日:2015-09-15
申请号:US13789285
申请日:2013-03-07
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Hsi-Sheng Wu , Hsu-Cheng Chiang , Kuo-Shu Hung , Kuel-Ker Sun
IPC: H05K7/20
CPC classification number: H05K7/208 , H05K7/20754 , H05K7/20827
Abstract: A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.
Abstract translation: 提出了一种用于数据中心的模块,用于散热热源。 用于数据中心的模块包括第一室,第二室和热管。 热源位于第一室中。 第二腔室与第一腔室相邻。 此外,热管具有位于第一室内的蒸发端和位于第二室内的冷凝端。 热管吸收具有蒸发端的第一室中的热能,将热能传递到冷凝端,并且消除具有冷凝端的热能。
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