Invention Grant
- Patent Title: Method of manufacturing a fabric type circuit board
- Patent Title (中): 织物型电路板的制造方法
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Application No.: US13551911Application Date: 2012-07-18
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Publication No.: US09144153B2Publication Date: 2015-09-22
- Inventor: Ji Eun Kim , Bae Sun Kim , Yong Ki Son , Sung Yong Shin , Il Yeon Cho
- Applicant: Ji Eun Kim , Bae Sun Kim , Yong Ki Son , Sung Yong Shin , Il Yeon Cho
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Agency: Staas & Halsey LLP
- Priority: KR10-2011-0101024 20111005
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H05K1/03 ; H05K1/14 ; H05K3/36 ; H05K3/40

Abstract:
A fabric type circuit board in which a conductive pattern is provided both faces of fabrics and a method of manufacturing the same. A fabric type circuit board includes fabrics and a conductive pattern in which extension units folded from one side of the fabrics to another side of the fabrics are formed, wherein the conductive pattern is formed using at least one of a copper film transfer printing scheme, printing, etching, embroidery, and sewing. A method of manufacturing a fabric type circuit board includes forming a conductive pattern, having extension units formed therein, on fabrics, cutting a part of the fabrics on which the conductive pattern is formed, and forming contact surfaces by folding the extension units from one side of the fabrics to another side of the fabrics.
Public/Granted literature
- US20130087369A1 FABRIC TYPE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-04-11
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