Invention Grant
US09146880B2 System-on-chip for providing access to shared memory via chip-to-chip link, operation method of the same, and electronic system including the same
有权
片上系统,用于通过芯片到芯片链路提供对共享存储器的访问,其操作方法以及包括其的电子系统
- Patent Title: System-on-chip for providing access to shared memory via chip-to-chip link, operation method of the same, and electronic system including the same
- Patent Title (中): 片上系统,用于通过芯片到芯片链路提供对共享存储器的访问,其操作方法以及包括其的电子系统
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Application No.: US13895606Application Date: 2013-05-16
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Publication No.: US09146880B2Publication Date: 2015-09-29
- Inventor: Jung-hun Heo , Jae-youl Kim , Jae-gon Lee , Nam-phil Jo
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-Si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-Si, Gyeonggi-Do
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2012-0052087 20120516
- Main IPC: G06F12/14
- IPC: G06F12/14 ; G06F13/16 ; G06F3/06 ; G06F1/32

Abstract:
An electronic system including a system-on-chip (SoC) providing access to a shared memory via a chip-to-chip link includes a memory device, a first semiconductor device, and a second semiconductor device. The first semiconductor device includes a first central processing unit (CPU) and a memory access path configured to enable access to the memory device. The second semiconductor device is configured to access the memory device via the memory access path of the first semiconductor device. The second semiconductor device is permitted to access the memory device while the memory access path is active and the first CPU is inactive, and the memory access path is configured to become active without intervention of the first CPU.
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