Invention Grant
- Patent Title: Hermetically sealed polymer capacitors with high stability at elevated temperatures
- Patent Title (中): 在高温下具有高稳定性的密封聚合物电容器
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Application No.: US14018001Application Date: 2013-09-04
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Publication No.: US09147530B2Publication Date: 2015-09-29
- Inventor: Steven C. Hussey , Yuri Freeman , Philip M. Lessner , Qingping Chen , Javaid Qazi
- Applicant: Kemet Electronics Corporation
- Applicant Address: US SC Simpsonville
- Assignee: KEMET Electronics Corporation
- Current Assignee: KEMET Electronics Corporation
- Current Assignee Address: US SC Simpsonville
- Agency: Perkins Law Firm, LLC
- Agent Joseph T. Guy
- Main IPC: H01G9/00
- IPC: H01G9/00 ; H01G13/00 ; H01G9/012 ; H01G9/028 ; H01G9/042 ; H01G9/06 ; H01G9/08 ; H01G9/15
Abstract:
A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.
Public/Granted literature
- US20140061284A1 Hermetically Sealed Polymer Capacitors with High Stability at Elevated Temperatures Public/Granted day:2014-03-06
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