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Patent Agency Ranking
公开(公告)号：US20190287730A1
公开(公告)日：2019-09-19
申请号：US15921786
申请日：2018-03-15
Applicant: KEMET Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Christian Guerrero , Chris Stolarski , Jeffrey N. Kelly , Philip M. Lessner , Siva Jyoth Lingala , Javaid Qazi
Abstract: An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.
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2.发明申请Hermetically Sealed Polymer Capacitors with High Stability at Elevated Temperatures 有权在高温下具有高稳定性的密封聚合物电容器公开(公告)号：US20140061284A1
公开(公告)日：2014-03-06
申请号：US14018001
申请日：2013-09-04
Applicant: Kemet Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Philip M. Lessner , Qingping Chen , Javaid Qazi
IPC: H01G13/00
CPC classification number: H01G13/00 , B23K2101/38 , H01G9/012 , H01G9/028 , H01G9/0425 , H01G9/06 , H01G9/08 , H01G9/15
Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.
Abstract translation: 一种用于提供改进的密封电容器的方法，包括以下步骤：将焊料和助焊剂施加到壳体的内表面; 将焊料流到内表面上; 去除焊剂，从而形成焊剂耗尽的焊料; 将电容元件插入壳体中; 回流焊剂消耗的焊料，从而在外壳和可焊层之间形成焊接接头; 并密封外壳。
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公开(公告)号：US10777362B2
公开(公告)日：2020-09-15
申请号：US16684828
申请日：2019-11-15
Applicant: KEMET Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Christian Guerrero , Chris Stolarski , Jeffrey N. Kelly , Philip M. Lessner , Siva Jyoth Lingala , Javaid Qazi
Abstract: An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.
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公开(公告)号：US20200090875A1
公开(公告)日：2020-03-19
申请号：US16684828
申请日：2019-11-15
Applicant: KEMET Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Christian Guerrero , Chris Stolarski , Jeffrey N. Kelly , Philip M. Lessner , Siva Jyoth Lingala , Javaid Qazi
Abstract: An improved capacitor, and method of manufacturing the improved capacitor, is provided. The method includes deoxygenating and leaching the anode wire to produce a capacitor comprising an anode having a surface area of at least 4.0 m2/g or a charge density of at least 200,000 CV/g with the anode wire having an equivalent diameter of less than 0.30 mm extending from said anode. A dielectric is on the anode and a cathode is on the dielectric.
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5.发明授权Hermetically sealed polymer capacitors with high stability at elevated temperatures 有权在高温下具有高稳定性的密封聚合物电容器公开(公告)号：US09147530B2
公开(公告)日：2015-09-29
申请号：US14018001
申请日：2013-09-04
Applicant: Kemet Electronics Corporation
Inventor： Steven C. Hussey , Yuri Freeman , Philip M. Lessner , Qingping Chen , Javaid Qazi
CPC classification number: H01G13/00 , B23K2101/38 , H01G9/012 , H01G9/028 , H01G9/0425 , H01G9/06 , H01G9/08 , H01G9/15
Abstract: A process for providing an improved hermetically sealed capacitor which includes the steps of applying a solder and a flux to an interior surface of a case; flowing the solder onto the interior surface; remove flux thereby forming a flux depleted solder; inserting the capacitive element into the casing; reflowing the flux depleted solder thereby forming a solder joint between the case and the solderable layer; and sealing the case.
Abstract translation: 一种用于提供改进的密封电容器的方法，包括以下步骤：将焊料和助焊剂施加到壳体的内表面; 将焊料流到内表面上; 去除焊剂，从而形成焊剂耗尽的焊料; 将电容元件插入壳体中; 回流焊剂消耗的焊料，从而在外壳和可焊层之间形成焊接接头; 并密封外壳。
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