Invention Grant
- Patent Title: RF stacked power amplifier bias method
- Patent Title (中): 射频堆叠功率放大器偏置法
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Application No.: US14283129Application Date: 2014-05-20
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Publication No.: US09148088B1Publication Date: 2015-09-29
- Inventor: Jaw-Ming Ding
- Applicant: ADVANCED SEMICONDUCTOR ENGINEERING INC.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering Inc.
- Current Assignee: Advanced Semiconductor Engineering Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu; Angela D. Murch
- Main IPC: H03F3/04
- IPC: H03F3/04 ; H03G3/00 ; H03F1/02 ; H03F3/19 ; H03F3/21 ; H03F1/34 ; H03F1/30

Abstract:
The RF stacked power amplifier comprises a voltage-dividing circuit, a negative feedback bias circuit, a current source circuit and a stacked amplifying circuit. The voltage-dividing circuit receives a system voltage and divides the system voltage for outputting a first reference partial voltage and a second reference partial voltage. The negative feedback bias circuit receives a negative feedback reference voltage and correspondingly outputs a second bias reference voltage according to a result of comparing the second reference partial voltage and the negative feedback reference voltage. The current source circuit determines a bias reference current according to the first reference partial voltage. The stacked amplifying circuit outputs the negative feedback reference voltage and determines an operation bias point according to a first bias reference voltage and the bias reference current. The RF stacked power amplifier makes the voltage-drop and the power consumption of each transistor equal via the voltage-dividing circuit.
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