Invention Grant
- Patent Title: Chemical mechanical polishing composition for polishing silicon wafers and related methods
- Patent Title (中): 用于抛光硅片的化学机械抛光组合物及相关方法
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Application No.: US14039390Application Date: 2013-09-27
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Publication No.: US09150759B2Publication Date: 2015-10-06
- Inventor: Yasuyuki Itai , Naresh Kumar Penta , Naoko Kawai , Hiroyuki Nakano , Shinichi Haba , Yoshiharu Ota , Takayuki Matsushita , Masashi Teramoto , Sakiko Nakashima , Tomoyuki Toda , Koichi Yoshida , Lee Melbourne Cook
- Applicant: Rohm and Haas Electronic Materials CMP Holdings, Inc. , Nitta Haas Incorporated
- Applicant Address: US DE Newark JP Osaka
- Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc,Nitta Haas Incorporated
- Current Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc,Nitta Haas Incorporated
- Current Assignee Address: US DE Newark JP Osaka
- Agent Thomas S. Deibert
- Main IPC: H01L21/302
- IPC: H01L21/302 ; C09G1/02 ; H01L21/3105 ; H01L21/306 ; H01L21/02
Abstract:
A chemical mechanical polishing composition for polishing silicon wafers is provided, containing: water, optionally, an abrasive; a cation according to formula (I); piperazine or a piperazine derivative according to formula (II); and, a quaternary ammonium compound; wherein the chemical mechanical polishing composition exhibits a pH of 9 to 12. Also provided are methods of making and using the chemical mechanical polishing composition.
Public/Granted literature
- US20150093900A1 CHEMICAL MECHANICAL POLISHING COMPOSITION FOR POLISHING SILICON WAFERS AND RELATED METHODS Public/Granted day:2015-04-02
Information query
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