发明授权
- 专利标题: Planar contact with solder
- 专利标题(中): 与焊料平面接触
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申请号: US13926069申请日: 2013-06-25
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公开(公告)号: US09155200B2公开(公告)日: 2015-10-06
- 发明人: Jack Seidler
- 申请人: Interplex Industries, Inc.
- 申请人地址: US NY College Point
- 专利权人: Interplex Industries, Inc.
- 当前专利权人: Interplex Industries, Inc.
- 当前专利权人地址: US NY College Point
- 代理机构: Preti Flaherty Beliveau & Pachios LLP
- 主分类号: H01R9/00
- IPC分类号: H01R9/00 ; H05K3/00 ; B23K35/02 ; H01R43/02 ; H05K3/34 ; H01R12/57 ; H01R12/70
摘要:
A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
公开/授权文献
- US20130283608A1 Planar Contact with Solder 公开/授权日:2013-10-31
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