Invention Grant
- Patent Title: Planar contact with solder
- Patent Title (中): 与焊料平面接触
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Application No.: US13926069Application Date: 2013-06-25
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Publication No.: US09155200B2Publication Date: 2015-10-06
- Inventor: Jack Seidler
- Applicant: Interplex Industries, Inc.
- Applicant Address: US NY College Point
- Assignee: Interplex Industries, Inc.
- Current Assignee: Interplex Industries, Inc.
- Current Assignee Address: US NY College Point
- Agency: Preti Flaherty Beliveau & Pachios LLP
- Main IPC: H01R9/00
- IPC: H01R9/00 ; H05K3/00 ; B23K35/02 ; H01R43/02 ; H05K3/34 ; H01R12/57 ; H01R12/70

Abstract:
A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.
Public/Granted literature
- US20130283608A1 Planar Contact with Solder Public/Granted day:2013-10-31
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