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公开(公告)号：US11901524B2
公开(公告)日：2024-02-13
申请号：US17284466
申请日：2019-10-15
发明人： Craig Kennedy , Vu Phan
IPC分类号： H01M10/48 , H01M50/519 , H01M50/507 , H01M50/522 , H01M10/42 , H01M50/569 , H01M50/50
CPC分类号： H01M10/482 , H01M10/425 , H01M10/486 , H01M50/50 , H01M50/507 , H01M50/519 , H01M50/522 , H01M50/569 , H01M2220/20
摘要： A battery module having a plurality of battery cells disposed in a housing and interconnected by upper and lower interconnect panels stamped from sheets of conductive metal. Each of the upper and lower interconnect panels have a plurality of contacts secured to terminals of the battery cells, respectively. The contacts are at least partially disposed in panel openings extending through the upper and lower interconnect panels. A carrier is provided and includes a lead frame molded into a body of thermoplastic resin. The lead frame connects a plurality of locations on the upper and lower interconnect panels to a monitoring module that measures physical properties at the locations.
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公开(公告)号：US20230411899A1
公开(公告)日：2023-12-21
申请号：US18211383
申请日：2023-06-19
发明人： Richard Schneider
IPC分类号： H01R13/516 , H01R13/73 , H02J7/00 , B60L53/16 , B60L53/35
CPC分类号： H01R13/516 , H01R13/73 , H02J7/0045 , B60L53/16 , B60L53/35 , H01R2201/26
摘要： A coupling apparatus having first and second connector parts. The first connector part includes first busbars held in a first housing, and the second connector part includes second busbars held in a second housing. The first and second busbars may be annular and are connected to electrical conductors, respectively. A gimbal helps connect the second connector part to a mount, which may be moved by a lift. The gimbal is operable to permit the second connector part to pivot about a plurality of axes relative to the mount. The first and second connector parts are configured to be coupled together to electrically connect the first busbars to the second busbars.
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公开(公告)号：US20230335961A1
公开(公告)日：2023-10-19
申请号：US18027099
申请日：2021-09-30
发明人： Richard Schneider
IPC分类号： H01R25/16 , H01R13/6584 , H01R4/48 , H01R13/24
CPC分类号： H01R25/162 , H01R4/48 , H01R13/2421 , H01R13/6584
摘要： A connector assembly for connecting a bus bar to an electrical component. The connector assembly includes an electrically conductive housing defining an inner cavity. A plurality of canted coil contacts are partially disposed within the inner cavity and protrude therefrom so as to be partially disposed outside the housing. The coil contacts are electrically connected to the housing. A first end portion of an electrically conductive, flexible bridge is connected to the housing. A second end portion of the bridge is configured for connection to the electrical component. A holding apparatus holds the housing against the bus bar such that the coil contacts are pressed against the bus bar to make an electrical connection therewith.
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公开(公告)号：US20220209433A1
公开(公告)日：2022-06-30
申请号：US17601400
申请日：2020-04-14
发明人： Yin Qian , Keith S. Maranto , James M. Pick , Richard Schneider
IPC分类号： H01R4/2429 , H01R12/70 , H01R12/58 , H01R13/11 , H01R13/405 , H01R4/70
摘要： A multipart connector for electrical connection to a conductor to convey AC power having a frequency greater than 60 Hz. The connector includes a plurality of metal plates. Each metal plate has opposing planar surfaces and includes a pair of legs separated by a space. A plurality of insulation layers adjoin the planar surfaces of the metal plates, respectively. The insulation layers include a pair of legs separated by a space. The metal plates and the insulation layers are arranged in a stack such that the spaces of the metal plates and the insulation layers are aligned to form a groove extending through the stack. The conductor is disposed in the groove.
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公开(公告)号：US10998675B2
公开(公告)日：2021-05-04
申请号：US15931195
申请日：2020-05-13
发明人： Joseph Lynch , Richard Schneider
IPC分类号： H01R13/631 , H01R13/405 , H01R12/58 , H01R13/504
摘要： A connector for connection to a substrate for mounting electronic devices. The connector includes a plurality of coupling contacts pivotably disposed within a housing. Each coupling contact is generally H-shaped and defines opposing first and second spaces. The connector also includes one or more mounting contacts partially disposed within the housing. Each mounting contact has a fastening structure joined to a bar section. The fastening structure is adapted for securement to the substrate and the bar section is disposed in a second space of at least one of the coupling contacts.
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公开(公告)号：US10522945B2
公开(公告)日：2019-12-31
申请号：US16190809
申请日：2018-11-14
IPC分类号： H01R4/48 , H01R13/631 , H01R12/71 , H01R13/10 , H01R12/58 , H01R12/70 , H01R12/91 , H01R13/11 , H01R13/42 , H01R12/73
摘要： A connector for connection to a substrate for mounting electronic devices. The connector includes a stack of coupling contacts pivotably disposed within a housing. Each coupling contact is generally H-shaped and defines opposing first and second spaces. The first and second spaces are aligned to form first and second receiving grooves in the stack, respectively. The connector also includes one or more mounting contacts partially disposed within the housing. Each mounting contact has a fastening structure joined to a bar section. The fastening structure is adapted for securement to the substrate and the bar section is disposed in the second receiving groove of the stack of coupling contacts.
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公开(公告)号：US10485092B2
公开(公告)日：2019-11-19
申请号：US15552116
申请日：2016-02-16
发明人： Richard Schneider , Joseph J. Lynch
摘要： A multilayer bus board comprising a multilayer stacked assembly including a plurality of electrically conductive first layers, and at least one second dielectric layer disposed between adjacent first layers; and a frame formed of a dielectric material, the frame encapsulating at least a portion of the multilayer stacked assembly and mechanically maintaining the first and second layers in secure aligned abutting relation.
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公开(公告)号：US20100124036A1
公开(公告)日：2010-05-20
申请号：US12622899
申请日：2009-11-20
申请人： Richard Schneider
发明人： Richard Schneider
IPC分类号： H05K7/00
CPC分类号： H05K7/12 , H01G2/04 , H01G2/06 , H01G9/08 , H05K3/301 , H05K2201/10015 , H05K2201/10325
摘要： A solderless electronic component or capacitor mount assembly including a housing having a base portion and a cover portion. The cover portion and base portion being couplable to each other so as to secure a capacitor to the housing. The assembly further including at least one connector configured to couple the assembly to a printed circuit board, and at least one electrical contact configured to contact a respective at least one lead of the capacitor and provide an electrical connection for the capacitor.
摘要翻译： 一种无焊电子部件或电容器安装组件，其包括具有基部和盖部的壳体。 盖部分和基部可彼此耦合，以便将电容器固定到壳体。 所述组件还包括至少一个连接器，其被配置为将所述组件耦合到印刷电路板，以及至少一个电触点，其被配置为接触所述电容器的相应的至少一个引线并提供所述电容器的电连接。
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公开(公告)号：US20090298218A1
公开(公告)日：2009-12-03
申请号：US12472286
申请日：2009-05-26
IPC分类号： H01L21/50 , H05K7/18 , B05D5/12 , H01L31/0203 , H01L31/0232
CPC分类号： H01L23/49861 , H01L23/49537 , H01L31/02008 , H01L31/044 , H01L31/0543 , H01L2924/0002 , Y02E10/52 , H01L2924/00
摘要： A lead frame thermoplastic package for a solar cell, and a method of manufacturing the same. The lead frame being either a single-lead frame design or a dual-lead frame design. The single-lead frame design being made up of a single-lead metal frame. The dual-lead frame design being made up of a die pad lead frame, a wire bond lead frame, and being encapsulated in a thermoplastic resin. Optionally, the single lead frame or at least one of the dual-lead frames is coated with a dielectric material. The lead frame providing connections for a semiconductor die, a diode, and the associated electrical connections. The lead frame also providing a large surface area metal pad for cooling, and mounting tabs for securing various optics systems to the package. Optionally, the lead frame is incorporated into a solar cell including the lead frame, a semiconductor die, a diode, an optics system, and an integrated electrical connection system.
摘要翻译： 一种用于太阳能电池的引线框架热塑性封装及其制造方法。 引线框架是单引线框架设计或双引线框架设计。 单引线框架设计由单引线金属框架组成。 双引线框架设计由芯片引线框架，引线框架引线框架构成，并被封装在热塑性树脂中。 可选地，单引线框架或双引线框架中的至少一个涂覆有电介质材料。 引线框架为半导体管芯，二极管和相关联的电连接提供连接。 引线框架还提供用于冷却的大表面积金属焊盘，以及安装用于将各种光学系统固定到封装件的突出部。 可选地，引线框结合到包括引线框架，半导体管芯，二极管，光学系统和集成电连接系统的太阳能电池中。
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公开(公告)号：US11431141B1
公开(公告)日：2022-08-30
申请号：US16984807
申请日：2020-08-04
发明人： Richard Schneider
摘要： An electrically conductive contact and a method of forming the same. A precursor configuration is formed in a metal work piece. The precursor configuration has a precursor retention portion that includes a pair of precursor beams separated by a precursor slot. Forces are applied to deform the precursor configuration and thereby form a fastening section of the contact. The fastening section has a retention portion that includes a pair of finished beams separated by a finished slot. The retention portion has a different configuration than the precursor configuration.
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