Planar Contact with Solder
    2.
    发明申请
    Planar Contact with Solder 有权
    平面焊接

    公开(公告)号:US20130283608A1

    公开(公告)日:2013-10-31

    申请号:US13926069

    申请日:2013-06-25

    发明人: Jack Seidler

    IPC分类号: H05K3/00

    摘要: A method of fixing reflowable elements on electrical contacts. The method includes providing a strip having a number of electrical contacts, each contact including a contact body and a tail portion extending away from the contact body. The tail portions of the contacts are then disposed adjacent an elongate reflowable member. The elongate reflowable member is pushed onto the tail portions of the plurality of contacts. Subsequently, the elongate reflowable member is cut into a plurality of separate reflowable elements, each reflowable element corresponding to one of the tail portions. The electrical contacts with the reflowable element attached thereto are separated from the strip.

    摘要翻译: 将可回流元件固定在电触点上的方法。 该方法包括提供具有多个电触点的条带,每个触点包括接触体和远离接触体延伸的尾部。 然后将触头的尾部设置在细长的可回流构件附近。 细长的可回流构件被推到多个触点的尾部。 随后,细长可回流构件被切割成多个单独的可回流元件,每个可回流元件对应于尾部中的一个。 与附接到其上的可回流元件的电接触与条分离。