Invention Grant
- Patent Title: Adhesives including a filler material and related methods
- Patent Title (中): 粘合剂包括填料和相关方法
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Application No.: US13689144Application Date: 2012-11-29
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Publication No.: US09157014B2Publication Date: 2015-10-13
- Inventor: Shijian Luo , Xiao Li
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: C09J11/04
- IPC: C09J11/04 ; H01L21/683 ; C08K3/00 ; C08K3/04 ; C08K3/14 ; C08K3/22 ; C08K3/36 ; C08K7/18

Abstract:
Temporary adhesives include a thermoplastic polymer comprising from about 30% by weight to about 80% by weight of the temporary adhesive, a solvent comprising from about 20% by weight to about 70% by weight of the temporary adhesive, and a filler material comprising from about 0.2% to about 5% by weight of the temporary adhesive. Methods of processing a semiconductor device wafer include bonding the semiconductor device wafer to a surface of a carrier substrate using a temporary adhesive including a filler material comprising from about 0.2% to about 5% by weight of the temporary adhesive, thinning the semiconductor device wafer, and, while the temporary adhesive remains on the surface of the carrier substrate proximate a peripheral edge thereof, subjecting the thinned semiconductor device wafer to one or more back side processing operations. Methods of forming a thinned semiconductor wafer include using such a temporary adhesive.
Public/Granted literature
- US20140147989A1 TEMPORARY ADHESIVES INCLUDING A FILLER MATERIAL AND RELATED METHODS Public/Granted day:2014-05-29
Information query
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