Invention Grant
US09157014B2 Adhesives including a filler material and related methods 有权
粘合剂包括填料和相关方法

Adhesives including a filler material and related methods
Abstract:
Temporary adhesives include a thermoplastic polymer comprising from about 30% by weight to about 80% by weight of the temporary adhesive, a solvent comprising from about 20% by weight to about 70% by weight of the temporary adhesive, and a filler material comprising from about 0.2% to about 5% by weight of the temporary adhesive. Methods of processing a semiconductor device wafer include bonding the semiconductor device wafer to a surface of a carrier substrate using a temporary adhesive including a filler material comprising from about 0.2% to about 5% by weight of the temporary adhesive, thinning the semiconductor device wafer, and, while the temporary adhesive remains on the surface of the carrier substrate proximate a peripheral edge thereof, subjecting the thinned semiconductor device wafer to one or more back side processing operations. Methods of forming a thinned semiconductor wafer include using such a temporary adhesive.
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