Invention Grant
- Patent Title: Mobile device cover including at least one antenna
- Patent Title (中): 移动设备盖包括至少一个天线
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Application No.: US14280796Application Date: 2014-05-19
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Publication No.: US09160061B2Publication Date: 2015-10-13
- Inventor: Anand Konanur , Ulun Karacaoglu , Songnan Yang , Shawn McEuen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INTEL CORPORATION
- Current Assignee: INTEL CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Shichrur & Co.
- Main IPC: H01Q1/24
- IPC: H01Q1/24 ; H01Q1/22 ; H01Q1/40 ; H01Q21/28
Abstract:
Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.
Public/Granted literature
- US20140333489A1 METHOD AND APPARATUS FOR IN-MOLD LAMINATE ANTENNAS Public/Granted day:2014-11-13
Information query
