公开(公告)号：US09627742B2

公开(公告)日：2017-04-18

申请号：US14871532

申请日：2015-09-30

Applicant: INTEL CORPORATION

Inventor： Anand Konanur ,  Ulun Karacaoglu ,  Songnan Yang ,  Shawn McEuen

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q21/28

CPC classification number: H01Q1/243 ,  H01Q1/2266 ,  H01Q1/40 ,  H01Q21/28

Abstract: Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

公开(公告)号：US09483126B2

公开(公告)日：2016-11-01

申请号：US15155272

申请日：2016-05-16

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Russell S. Aoki ,  Paul J. Gwin ,  Ralph V. Miele ,  Shawn McEuen ,  Mark MacDonald ,  David Pidwerbecki

IPC: E05D11/08 ,  H05K5/02 ,  G06F1/16 ,  G06F3/033

CPC classification number: G06F3/033 ,  E05D3/02 ,  E05D11/08 ,  E05D11/082 ,  E05D2011/085 ,  E05D2011/088 ,  G06F1/1616 ,  G06F1/1679 ,  G06F1/1681 ,  G06F1/1683 ,  H05K5/0226

Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a shaft rotatable about a first axis, a brake selectively engageable with a portion of the shaft, and an electroactive polymer (EAP) actuator coupled to the brake, wherein the EAP actuator selectively engages the brake with a portion of the shaft in response to a signal from the controller. Other examples may be described.

公开(公告)号：US09353560B2

公开(公告)日：2016-05-31

申请号：US14318288

申请日：2014-06-27

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Russell S. Aoki ,  Paul J. Gwin ,  Ralph V. Miele ,  Shawn McEuen ,  Mark MacDonald ,  David Pidwerbecki

IPC: E05D11/08 ,  E05D3/02 ,  G06F1/16 ,  H05K5/02

CPC classification number: G06F3/033 ,  E05D3/02 ,  E05D11/08 ,  E05D11/082 ,  E05D2011/085 ,  E05D2011/088 ,  G06F1/1616 ,  G06F1/1679 ,  G06F1/1681 ,  G06F1/1683 ,  H05K5/0226

Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a shaft rotatable about a first axis, a brake selectively engageable with a portion of the shaft, and an electroactive polymer (EAP) actuator coupled to the brake, wherein the EAP actuator selectively engages the brake with a portion of the shaft in response to a signal from the controller. Other examples may be described.

Abstract translation: 在一个示例中，电子设备包括控制器，包括第一部分和第二部分的底盘以及将底盘的第一部分连接到底架的第二部分的铰链组件，包括可围绕第一轴线旋转的轴， 制动器可选择性地与轴的一部分接合，以及耦合到制动器的电活性聚合物（EAP）致动器，其中响应于来自控制器的信号，EAP致动器选择性地将制动器与轴的一部分接合。 可以描述其他示例。

公开(公告)号：US20230022182A1

公开(公告)日：2023-01-26

申请号：US17710822

申请日：2022-03-31

Applicant: The Intel Corporation

Inventor： Juha Paavola ,  Justin M. Huttula ,  Jerrod Peterson ,  Shawn McEuen ,  Kerry A. Stevens

IPC: G06F1/20 ,  H05K7/20

Abstract: Thermal management systems having pre-stressed biasing elements and related methods are disclosed. An example electronic component includes a circuit board, a processor coupled to the circuit board, and a thermally conductive structure positioned adjacent the processor. The thermally conductive structure is to dissipate heat generated by the processor. The electronic component includes a pre-stressed biasing element coupled to the thermally conductive structure and positioned between the processor and the thermally conductive structure. The pre-stressed biasing element is pre-stressed prior to attachment to the thermally conductive structure and the circuit board.

公开(公告)号：US09715255B2

公开(公告)日：2017-07-25

申请号：US14318257

申请日：2014-06-27

Applicant: Intel Corporation

Inventor： Mark E. Sprenger ,  Russell S. Aoki ,  Shawn McEuen ,  Mark MacDonald ,  David Pidwerbecki

IPC: G06F1/16

CPC classification number: G06F1/1681 ,  G06F1/1616 ,  H04M1/022

Abstract: In one example an electronic device comprises a controller, a chassis comprising a first section and a second section, and a hinge assembly to connect the first section of the chassis to the second section of the chassis comprising a housing, a first shaft rotatable about a first axis, a second shaft rotatable about a second axis, a belt drive assembly to couple the first shaft to the second shaft, and a tension assembly to apply a tension to the belt drive assembly. Other examples may be described.

公开(公告)号：US09372507B2

公开(公告)日：2016-06-21

申请号：US14040638

申请日：2013-09-28

Applicant: Intel Corporation

Inventor： Ben Dekock ,  Shawn McEuen

IPC: G06F1/16

CPC classification number: G06F1/1626 ,  A45F2200/0525 ,  G06F1/166 ,  G06F2200/1633

Abstract: A support that is selectively adjustable to a plurality of configurations that enable a variety of viewing/user orientations of a mobile device. The mobile device includes a display, a back panel, a support positioned at the back panel, and adjustment members pivotally connected to respective outer ends of the support and mounted at the back panel to facilitate linear, reciprocating movement along an axis so as to change the relative orientation of the support relative to the back panel.

Abstract translation: 可以选择性地调整为支持移动设备的各种观看/用户取向的多种配置的支持。 移动设备包括显示器，后面板，位于后面板的支撑件和可枢转地连接到支撑件的相应外端的调节构件，并安装在后面板上，以便于沿轴线的线性往复运动，以便改变 支撑件相对于后面板的相对定向。

公开(公告)号：US09601823B2

公开(公告)日：2017-03-21

申请号：US15092886

申请日：2016-04-07

Applicant: INTEL CORPORATION

Inventor： Anand Konanur ,  Ulun Karacaoglu ,  Songnan Yang ,  Shawn McEuen

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q21/28

CPC classification number: H01Q1/243 ,  H01Q1/2266 ,  H01Q1/40 ,  H01Q21/28

Abstract: Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

公开(公告)号：US09160061B2

公开(公告)日：2015-10-13

申请号：US14280796

申请日：2014-05-19

Applicant: Intel Corporation

Inventor： Anand Konanur ,  Ulun Karacaoglu ,  Songnan Yang ,  Shawn McEuen

IPC: H01Q1/24 ,  H01Q1/22 ,  H01Q1/40 ,  H01Q21/28

CPC classification number: H01Q1/243 ,  H01Q1/2266 ,  H01Q1/40 ,  H01Q21/28

Abstract: Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

Abstract translation: 本文通常描述用于提供模内层压天线的系统和方法的实施例。 可以描述和要求保护其他实施例。

公开(公告)号：US12193149B2

公开(公告)日：2025-01-07

申请号：US17132329

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Sami Markus Heinisuo ,  Evan Piotr Kuklinski ,  Kari Pekka Johannes Mansukoski ,  Shawn McEuen

IPC: H05K1/02 ,  H01L23/60

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate that includes traces, a radiation source on the substrate, and a trace routable radiation shield on the substrate. At least a portion of the traces extend through the trace routable radiation shield and the trace routable radiation shield can help shield radiation sensitive components from at least a portion of the radiation from the radiation source.

公开(公告)号：US20210153339A1

公开(公告)日：2021-05-20

申请号：US17132329

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Sami Markus Heinisuo ,  Evan Piotr Kuklinski ,  Kari Pekka Johannes Mansukoski ,  Shawn McEuen

IPC: H05K1/02 ,  H01L23/60

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate that includes traces, a radiation source on the substrate, and a trace routable radiation shield on the substrate. At least a portion of the traces extend through the trace routable radiation shield and the trace routable radiation shield can help shield radiation sensitive components from at least a portion of the radiation from the radiation source.