Invention Grant
- Patent Title: Reducing registration error of front and back wafer surfaces utilizing a see-through calibration wafer
- Patent Title (中): 使用透视校准晶圆减少前后晶片表面的配准误差
-
Application No.: US13864701Application Date: 2013-04-17
-
Publication No.: US09163928B2Publication Date: 2015-10-20
- Inventor: Shouhong Tang , Chunhai Wang , Andrew An Zeng
- Applicant: KLA-Tencor Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA-Tencor Corporation
- Current Assignee: KLA-Tencor Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01B11/02
- IPC: G01B11/02 ; G01B9/02 ; G01B11/06 ; G01B11/24

Abstract:
A calibration wafer and a method for calibrating an interferometer system are disclosed. The calibration method includes: determining locations of the holes defined in the calibration wafer based on two opposite intensity frame; comparing the locations of the holes against the locations measured utilizing an external measurement device; adjusting a first optical magnification or a second optical magnification at least partially based on the comparison result; defining a distortion map for each of the first and second intensity frames based on the comparison of the locations of the holes; generating an extended distortion map for each of the first and second intensity frames by map fitting the distortion map; and utilizing the extended distortion map for each of the first and second intensity frames to reduce at least one of: a registration error or an optical distortion in a subsequent measurement process.
Public/Granted literature
- US20140313516A1 Reducing Registration Error of Front and Back Wafer Surfaces Utilizing a See-Through Calibration Wafer Public/Granted day:2014-10-23
Information query