Invention Grant
US09165890B2 Chip package comprising alignment mark and method for forming the same
有权
包括对准标记的芯片封装及其形成方法
- Patent Title: Chip package comprising alignment mark and method for forming the same
- Patent Title (中): 包括对准标记的芯片封装及其形成方法
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Application No.: US13941854Application Date: 2013-07-15
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Publication No.: US09165890B2Publication Date: 2015-10-20
- Inventor: Yen-Shih Ho , Shih-Chin Chen , Yi-Ming Chang , Chien-Hui Chen , Chia-Ming Cheng , Wei-Luen Suen , Chen-Han Chiang
- Applicant: XINTEC INC.
- Applicant Address: TW Taoyuan
- Assignee: XINTEC INC.
- Current Assignee: XINTEC INC.
- Current Assignee Address: TW Taoyuan
- Agency: Liu & Liu
- Main IPC: H01L23/544
- IPC: H01L23/544 ; H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L21/78 ; H01L23/31 ; H01L23/00
Abstract:
An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and an opposite second surface; a device region disposed in the substrate; a dielectric layer located on the first surface of the semiconductor substrate; a plurality of conducting pads located in the dielectric layer and electrically connected to the device region; at least one alignment mark disposed in the semiconductor substrate and extending from the second surface towards the first surface.
Public/Granted literature
- US20140015111A1 CHIP PACKAGE AND METHOD FOR FORMING THE SAME Public/Granted day:2014-01-16
Information query
IPC分类:
