Invention Grant
- Patent Title: Composite LED package and its application to light tubes
- Patent Title (中): 复合LED封装及其应用于灯管
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Application No.: US13943906Application Date: 2013-07-17
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Publication No.: US09166131B2Publication Date: 2015-10-20
- Inventor: Tseng-Bao Sun , Jr-Jie Wang
- Applicant: Tai-Yin Huang
- Applicant Address: US PA Macungie
- Assignee: Tai-Yin Huang
- Current Assignee: Tai-Yin Huang
- Current Assignee Address: US PA Macungie
- Agency: Rosenberg, Klein & Lee
- Main IPC: H01L27/15
- IPC: H01L27/15 ; H01L29/26 ; H01L31/12 ; H01L33/00 ; H01L29/267 ; H01L23/48 ; H01L33/62 ; F21K99/00 ; H01L33/38 ; H01L33/20 ; H01L25/075 ; H01L33/54 ; F21Y101/02 ; F21Y103/00
Abstract:
A light emitting diode package includes a first lead frame, a second lead frame and an encapsulant. The first lead frame has a die deposition area on the top thereof for disposing LED die. The second lead frame has a contacting face on the top thereof for wire bonding. The die deposition area of the first lead frame has a first adhesion area such that the encapsulant is held by the first adhesion area when enclosing the top and bottom of the first and second lead frames. The light is emitted in all directions.
Public/Granted literature
- US20150021648A1 COMPOSITE LED PACKAGE AND ITS APPLICATION TO LIGHT TUBES Public/Granted day:2015-01-22
Information query
IPC分类:
