公开(公告)号：US09303824B2

公开(公告)日：2016-04-05

申请号：US14485695

申请日：2014-09-13

Applicant: Tai-Yin Huang

Inventor： Tseng-Bao Sun

IPC: F21K99/00 ,  F21V29/83 ,  F21V23/00 ,  F21Y101/02 ,  F21V3/02 ,  F21Y111/00 ,  F21V29/506 ,  F21V29/74

CPC classification number: F21K9/23 ,  F21K9/238 ,  F21V3/02 ,  F21V23/003 ,  F21V29/506 ,  F21V29/508 ,  F21V29/74 ,  F21V29/83 ,  F21Y2107/30 ,  F21Y2115/10

Abstract: The present disclosure provides an LED lighting device comprising a heat dissipation body, a driver module and a lighting module. The heat dissipation body includes a base, a heat dissipation wall, heat dissipation fins and a top face. The heat dissipation wall defines a heat dissipation channel therein and is formed with first through holes. The heat dissipation fins are formed on and encircle the heat dissipation wall. The top face is formed with a first opening The driver module is disposed inside the heat dissipation body. The lighting module includes a tube body and LED light sources. The tube body has two end openings in fluid communication with each other and one of the end openings is connected to the first opening The LED light sources are arranged on the tube body and are electrically connected to the driver module.

Abstract translation: 本公开提供了一种LED照明装置，其包括散热体，驱动器模块和照明模块。 散热体包括底座，散热壁，散热片和顶面。 散热壁在其中限定了散热通道，并且形成有第一通孔。 散热片形成在隔热壁上并包围散热壁。 顶面形成有第一开口。驱动器模块设置在散热体内。 照明模块包括管体和LED光源。 管体具有彼此流体连通的两个端部开口，并且一个端部开口连接到第一开口。LED光源布置在管体上并且电连接到驱动器模块。

公开(公告)号：US09166131B2

公开(公告)日：2015-10-20

申请号：US13943906

申请日：2013-07-17

Applicant: Tai-Yin Huang

Inventor： Tseng-Bao Sun ,  Jr-Jie Wang

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L29/267 ,  H01L23/48 ,  H01L33/62 ,  F21K99/00 ,  H01L33/38 ,  H01L33/20 ,  H01L25/075 ,  H01L33/54 ,  F21Y101/02 ,  F21Y103/00

CPC classification number: H01L33/62 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/49113 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting diode package includes a first lead frame, a second lead frame and an encapsulant. The first lead frame has a die deposition area on the top thereof for disposing LED die. The second lead frame has a contacting face on the top thereof for wire bonding. The die deposition area of the first lead frame has a first adhesion area such that the encapsulant is held by the first adhesion area when enclosing the top and bottom of the first and second lead frames. The light is emitted in all directions.

Abstract translation: 发光二极管封装包括第一引线框架，第二引线框架和密封剂。 第一引线框架在其顶部具有用于设置LED管芯的管芯沉积区域。 第二引线框架在其顶部具有用于引线接合的接触面。 第一引线框架的管芯沉积区域具有第一粘附区域，使得当封装第一引线框架和第二引线框架的顶部和底部时，密封剂由第一粘合区域保持。 光线向各个方向发射。