公开(公告)号：US09166131B2

公开(公告)日：2015-10-20

申请号：US13943906

申请日：2013-07-17

Applicant: Tai-Yin Huang

Inventor： Tseng-Bao Sun ,  Jr-Jie Wang

IPC: H01L27/15 ,  H01L29/26 ,  H01L31/12 ,  H01L33/00 ,  H01L29/267 ,  H01L23/48 ,  H01L33/62 ,  F21K99/00 ,  H01L33/38 ,  H01L33/20 ,  H01L25/075 ,  H01L33/54 ,  F21Y101/02 ,  F21Y103/00

CPC classification number: H01L33/62 ,  F21K9/27 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/49113 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A light emitting diode package includes a first lead frame, a second lead frame and an encapsulant. The first lead frame has a die deposition area on the top thereof for disposing LED die. The second lead frame has a contacting face on the top thereof for wire bonding. The die deposition area of the first lead frame has a first adhesion area such that the encapsulant is held by the first adhesion area when enclosing the top and bottom of the first and second lead frames. The light is emitted in all directions.

Abstract translation: 发光二极管封装包括第一引线框架，第二引线框架和密封剂。 第一引线框架在其顶部具有用于设置LED管芯的管芯沉积区域。 第二引线框架在其顶部具有用于引线接合的接触面。 第一引线框架的管芯沉积区域具有第一粘附区域，使得当封装第一引线框架和第二引线框架的顶部和底部时，密封剂由第一粘合区域保持。 光线向各个方向发射。