Invention Grant
- Patent Title: Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the same
- Patent Title (中): 半导体用密封组合物，半导体装置及其制造方法，聚合物及其制造方法
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Application No.: US14372237Application Date: 2013-01-16
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Publication No.: US09169353B2Publication Date: 2015-10-27
- Inventor: Shoko Ono , Yasuhisa Kayaba , Hirofumi Tanaka , Kazuo Kohmura , Tsuneji Suzuki , Shigeru Mio
- Applicant: MITSUI CHEMICALS, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUI CHEMICALS, INC.
- Current Assignee: MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2012-007151 20120117
- International Application: PCT/JP2013/050686 WO 20130116
- International Announcement: WO2013/108791 WO 20130725
- Main IPC: C08G73/02
- IPC: C08G73/02 ; H01L23/29 ; H01L21/02 ; H01L23/532 ; H01L21/56 ; C09J179/02 ; C09K3/10
Abstract:
In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis.
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