公开(公告)号：US10759964B2

公开(公告)日：2020-09-01

申请号：US15776013

申请日：2016-11-16

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Hiroko Wachi ,  Shoko Ono

IPC分类号： C09D177/06 ,  C08G73/02 ,  C08G73/10 ,  H01L21/02 ,  H01L21/3105 ,  C08G69/42 ,  H01L23/29 ,  C08K5/092 ,  C08K3/28 ,  C08K5/09

摘要： A composition for forming a film for semiconductor devices including: a compound (A) including a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and having a weight average molecular weight of from 10,000 to 400,000; a crosslinking agent (B) which includes the three or more —C(═O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(═O)OX groups are —C(═O)OH groups, and which has a weight average molecular weight of from 200 to 600; and water (D), in which the compound (A) is an aliphatic amine.

公开(公告)号：US10043677B2

公开(公告)日：2018-08-07

申请号：US15562072

申请日：2016-03-24

申请人： MITSUI CHEMICALS, INC.

发明人： Hirofumi Tanaka ,  Yasuhisa Kayaba ,  Hiroko Wachi ,  Koji Inoue ,  Shoko Ono

IPC分类号： H01L21/02 ,  H01L21/3105 ,  C08G73/02 ,  C09D179/02 ,  H01L21/311

摘要： A method for manufacturing a filling planarization film, the method including: a first coating step of applying a first coating liquid, containing a polyamine and a first solvent, to a region including a recessed part of a member having the recessed part, to fill the first coating liquid into the recessed part; and a second coating step of applying a second coating liquid, containing an organic substance having two or more carboxyl groups and a second solvent having a boiling point of 200° C. or less and an SP value of 30 (MPa)1/2 or less, to the region including the recessed part of the member into which the first coating liquid has been filled.

公开(公告)号：US10020238B2

公开(公告)日：2018-07-10

申请号：US14779757

申请日：2014-03-11

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa Kayaba ,  Shoko Ono ,  Hirofumi Tanaka ,  Tsuneji Suzuki ,  Shigeru Mio ,  Kazuo Kohmura

IPC分类号： H01L21/00 ,  H01L23/29 ,  C08L79/02 ,  H01L21/02 ,  C08K5/00 ,  C08G73/02 ,  C09J179/04 ,  H01L21/56 ,  H01L23/528 ,  H01L23/532

CPC分类号： H01L23/293 ,  C08G73/0206 ,  C08K5/0091 ,  C08L79/02 ,  C09J179/04 ,  H01L21/0206 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/56 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B

公开(公告)号：US11487205B2

公开(公告)日：2022-11-01

申请号：US16757830

申请日：2018-11-13

申请人： MITSUI CHEMICALS, INC.

发明人： Hiroko Wachi ,  Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Kenichi Fujii

IPC分类号： G03F7/11 ,  H01L21/311 ,  G03F7/075

摘要： Provided are a semiconductor element intermediate including: a substrate and a multilayer resist layer, in which the multilayer resist layer includes a metal-containing film, and in which the metal-containing film has a content of germanium element of 20 atm % or more, or a total content of tin element, indium element, and gallium element of 1 atm % or more, as measured by X-ray photoelectric spectroscopy, and an application of the semiconductor intermediate.

公开(公告)号：US10752805B2

公开(公告)日：2020-08-25

申请号：US15776031

申请日：2016-11-16

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Koji Inoue

IPC分类号： C09D11/00 ,  H01L21/683 ,  C09D177/06 ,  C08G73/02 ,  C08G73/10 ,  H01L21/02 ,  H01L21/3105 ,  C08G69/42 ,  H01L23/29 ,  C08K5/092 ,  C08K3/28 ,  C08K5/09

摘要： Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a Si—O bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more —C(═O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(═O)OX groups are —C(═O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).

公开(公告)号：US20140367868A1

公开(公告)日：2014-12-18

申请号：US14372237

申请日：2013-01-16

申请人： MITSUI CHEMICALS, INC.

发明人： Shoko Ono ,  Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Kazuo Kohmura ,  Tsuneji Suzuki ,  Shigeru Mio

IPC分类号： C08G73/02 ,  H01L23/29 ,  H01L21/56

CPC分类号： C08G73/0206 ,  C08G73/0213 ,  C08G73/0226 ,  C08G2190/00 ,  C09J179/02 ,  C09K3/1006 ,  C09K2003/1087 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/56 ,  H01L23/293 ,  H01L23/5329 ,  H01L2924/0002 ,  Y10T428/2982 ,  H01L2924/00

摘要： In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis.

摘要翻译： 在本发明中，提供了一种半导体用密封组合物，其包括包含两个或更多个阳离子官能团的聚合物，所述阳离子官能团包括叔氮原子或季氮原子中的至少一个，其重均分子量为2000〜 1,000,000，并且具有48％以上的支化度，其中，密封组合物中钠的含量和钾含量各自为10ppb以下。

公开(公告)号：US11965109B2

公开(公告)日：2024-04-23

申请号：US16929638

申请日：2020-07-15

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Koji Inoue

IPC分类号： C09D177/06 ,  C08G69/42 ,  C08G73/02 ,  C08G73/10 ,  H01L21/02 ,  H01L21/3105 ,  H01L23/29 ,  C08K3/28 ,  C08K5/09 ,  C08K5/092

CPC分类号： C09D177/06 ,  C08G69/42 ,  C08G73/0293 ,  C08G73/1003 ,  H01L21/02118 ,  H01L21/02142 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02318 ,  H01L21/02343 ,  H01L21/3105 ,  H01L23/296 ,  C08K3/28 ,  C08K5/09 ,  C08K5/092

摘要： Provided is a composition for forming a film for semiconductor devices, including: a compound (A) including a Si—O bond and a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom; a crosslinking agent (B) which includes three or more —C(═O)OX groups (X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms) in the molecule, in which from one to six of three or more —C(═O)OX groups are —C(═O)OH groups, and which has a weight average molecular weight of from 200 to 600; and a polar solvent (D).

公开(公告)号：US10950532B2

公开(公告)日：2021-03-16

申请号：US15535761

申请日：2015-12-14

申请人： Mitsui Chemicals, Inc.

发明人： Yasuhisa Kayaba ,  Shoko Ono ,  Hirofumi Tanaka ,  Koji Inoue ,  Hiroko Wachi

IPC分类号： H01L23/498 ,  H01L23/14 ,  H01L21/48 ,  H01L21/768 ,  H01L21/02 ,  H01L23/48 ,  H01L23/532

摘要： A substrate intermediary body includes: a substrate having a hole in a thickness direction, and a conductor being disposed in the hole; and an adhesion layer formed on a wall surface of the hole. The adhesion layer contains a reaction product of a polymer (A) having a cationic functional group and having a weight-average molecular weight of from 2,000 to 1,000,000 and a polyvalent carboxylic acid compound (B) having two or more carboxyl groups per molecule or a derivative thereof.

公开(公告)号：US11209735B2

公开(公告)日：2021-12-28

申请号：US16301885

申请日：2017-05-19

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa Kayaba ,  Shoko Ono ,  Hirofumi Tanaka

IPC分类号： G03F7/075 ,  H01L21/027 ,  H01L21/3065 ,  H01L21/02 ,  C09D201/00 ,  G03F7/16 ,  C09D7/40 ,  G03F7/11 ,  G03F7/09

摘要： A composition for forming a metal-containing film, the composition including: a compound (A) which is at least one selected from the group consisting of: a compound (a1) containing a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom, and a compound (a2) which is a compound other than the compound (a1) and which contains a nitrogen atom; and a compound (B) which is at least one selected from the group consisting of: a compound (b1) containing a carboxy group and at least one of a germanium atom, a tin atom, a selenium atom or a zirconium atom, and an ester of the compound (b1).

公开(公告)号：US10580639B2

公开(公告)日：2020-03-03

申请号：US15325511

申请日：2015-08-05

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Shoko Ono ,  Koji Inoue ,  Hiroko Wachi ,  Tsuneji Suzuki

IPC分类号： H01L21/02 ,  H01L23/532 ,  H01L21/3105 ,  C08L79/00 ,  C09D157/06

摘要： The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.