公开(公告)号：US11442066B2

公开(公告)日：2022-09-13

申请号：US16486723

申请日：2018-02-19

申请人： MITSUI CHEMICALS, INC. ,  NATIONAL INSTITUTES OF BIOMEDICAL INNOVATION, HEALTH AND NUTRITION ,  SAVID THERAPEUTICS INC.

发明人： Tsuneji Suzuki ,  Yoshiyuki Totani ,  Kosuke Mano ,  Shinichi Banba ,  Haruhiko Kamada ,  Taisuke Nakayama ,  Hiroki Akiba ,  Kouhei Tsumoto ,  Tsuyoshi Inoue

IPC分类号： G01N33/58 ,  G01N33/68 ,  C07K16/28 ,  C07K14/36 ,  C07D495/04 ,  C07D519/00

摘要： Finding a protein of a minute amount present on a cell membrane to provide a method for producing an antibody against the protein. Producing an antibody using a protein identified by an identification method including: a labeling step of using a labeling agent comprising at least one selected from bis-iminobiotin compounds and bis-biotin compounds to obtain cells having a labeled protein; a degradation step of preparing a degradation product for an immobilization treatment, the degradation product containing the labeled protein; an immobilization step of immobilizing the labeled protein contained in the degradation product for an immobilization treatment on a stationary phase via a streptavidin mutant; a cleavage step of releasing an analysis sample from the stationary phase on which the labeled protein is immobilized; and an analysis step of analyzing the analysis sample to identify the labeled protein.

公开(公告)号：US10020238B2

公开(公告)日：2018-07-10

申请号：US14779757

申请日：2014-03-11

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa Kayaba ,  Shoko Ono ,  Hirofumi Tanaka ,  Tsuneji Suzuki ,  Shigeru Mio ,  Kazuo Kohmura

IPC分类号： H01L21/00 ,  H01L23/29 ,  C08L79/02 ,  H01L21/02 ,  C08K5/00 ,  C08G73/02 ,  C09J179/04 ,  H01L21/56 ,  H01L23/528 ,  H01L23/532

CPC分类号： H01L23/293 ,  C08G73/0206 ,  C08K5/0091 ,  C08L79/02 ,  C09J179/04 ,  H01L21/0206 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/56 ,  H01L23/528 ,  H01L23/53209 ,  H01L23/5329 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided is a method for manufacturing a composite body, the method containing: a composition preparation process of preparing a composition that contains a polymer having a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000, and that has a pH of from 2.0 to 11.0; a composite member preparation process of preparing a composite member that includes a member A and a member B, a surface of the member B having a defined isoelectric point, and that satisfies a relationship: the isoelectric point of a surface of the member B

公开(公告)号：US20140367868A1

公开(公告)日：2014-12-18

申请号：US14372237

申请日：2013-01-16

申请人： MITSUI CHEMICALS, INC.

发明人： Shoko Ono ,  Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Kazuo Kohmura ,  Tsuneji Suzuki ,  Shigeru Mio

IPC分类号： C08G73/02 ,  H01L23/29 ,  H01L21/56

CPC分类号： C08G73/0206 ,  C08G73/0213 ,  C08G73/0226 ,  C08G2190/00 ,  C09J179/02 ,  C09K3/1006 ,  C09K2003/1087 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/56 ,  H01L23/293 ,  H01L23/5329 ,  H01L2924/0002 ,  Y10T428/2982 ,  H01L2924/00

摘要： In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis.

摘要翻译： 在本发明中，提供了一种半导体用密封组合物，其包括包含两个或更多个阳离子官能团的聚合物，所述阳离子官能团包括叔氮原子或季氮原子中的至少一个，其重均分子量为2000〜 1,000,000，并且具有48％以上的支化度，其中，密封组合物中钠的含量和钾含量各自为10ppb以下。

公开(公告)号：US09169353B2

公开(公告)日：2015-10-27

申请号：US14372237

申请日：2013-01-16

申请人： MITSUI CHEMICALS, INC.

发明人： Shoko Ono ,  Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Kazuo Kohmura ,  Tsuneji Suzuki ,  Shigeru Mio

IPC分类号： C08G73/02 ,  H01L23/29 ,  H01L21/02 ,  H01L23/532 ,  H01L21/56 ,  C09J179/02 ,  C09K3/10

CPC分类号： C08G73/0206 ,  C08G73/0213 ,  C08G73/0226 ,  C08G2190/00 ,  C09J179/02 ,  C09K3/1006 ,  C09K2003/1087 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02304 ,  H01L21/02362 ,  H01L21/56 ,  H01L23/293 ,  H01L23/5329 ,  H01L2924/0002 ,  Y10T428/2982 ,  H01L2924/00

摘要： In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis.

摘要翻译： 在本发明中，提供了一种半导体用密封组合物，其包括包含两个或更多个阳离子官能团的聚合物，所述阳离子官能团包括叔氮原子或季氮原子中的至少一个，其重均分子量为2000〜 1,000,000，并且具有48％以上的支化度，其中，密封组合物中钠的含量和钾含量各自为10ppb以下。

公开(公告)号：US10580639B2

公开(公告)日：2020-03-03

申请号：US15325511

申请日：2015-08-05

申请人： MITSUI CHEMICALS, INC.

发明人： Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Shoko Ono ,  Koji Inoue ,  Hiroko Wachi ,  Tsuneji Suzuki

IPC分类号： H01L21/02 ,  H01L23/532 ,  H01L21/3105 ,  C08L79/00 ,  C09D157/06

摘要： The invention provides a sealing composition including: polymer (A) containing a cationic functional group and having a weight average molecular weight of from 2,000 to 1,000,000; and a benzotriazole compound; in which the content of the polymer (A) is from 0.05 parts by mass to 0.20 parts by mass with respect to 100 parts by mass of the sealing composition; in which the content of the benzotriazole compound in the sealing composition is from 3 ppm by mass to 200 ppm by mass; and in which the sealing composition has a pH of from 3.0 to 6.5.

公开(公告)号：US09780008B2

公开(公告)日：2017-10-03

申请号：US14413554

申请日：2013-07-12

申请人： MITSUI CHEMICALS, INC.

发明人： Shoko Ono ,  Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Kazuo Kohmura ,  Tsuneji Suzuki

IPC分类号： H01L23/29 ,  H01L21/02 ,  H01L21/3105 ,  H01L21/768 ,  H01L21/311 ,  C09K13/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/532 ,  C09D179/02 ,  C08G73/02

CPC分类号： H01L23/293 ,  C08G73/0206 ,  C09D179/02 ,  C09K13/00 ,  H01L21/02063 ,  H01L21/02093 ,  H01L21/02118 ,  H01L21/02164 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02334 ,  H01L21/02343 ,  H01L21/02362 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/56 ,  H01L21/76831 ,  H01L23/3185 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.

公开(公告)号：US20150187670A1

公开(公告)日：2015-07-02

申请号：US14413554

申请日：2013-07-12

申请人： MITSUI CHEMICALS, INC.

发明人： Shoko Ono ,  Yasuhisa Kayaba ,  Hirofumi Tanaka ,  Kazuo Kohmura ,  Tsuneji Suzuki

IPC分类号： H01L23/29 ,  C09K13/00 ,  H01L23/532 ,  H01L23/31 ,  H01L21/02 ,  H01L21/56

CPC分类号： H01L23/293 ,  C08G73/0206 ,  C09D179/02 ,  C09K13/00 ,  H01L21/02063 ,  H01L21/02093 ,  H01L21/02118 ,  H01L21/02164 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/02334 ,  H01L21/02343 ,  H01L21/02362 ,  H01L21/3105 ,  H01L21/31058 ,  H01L21/31133 ,  H01L21/56 ,  H01L21/76831 ,  H01L23/3185 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for manufacturing a semiconductor device including: a process of applying a sealing composition for a semiconductor to a semiconductor substrate, to form a sealing layer for a semiconductor on at least the bottom face and the side face of a recess portion of an interlayer insulating layer, the sealing composition including a polymer having a cationic functional group and a weight average molecular weight of from 2,000 to 1,000,000, each of the content of sodium and the content of potassium in the sealing composition being 10 ppb by mass or less on an elemental basis; and a process of subjecting a surface of the semiconductor substrate at a side at which the sealing layer has been formed to heat treatment of from 200° C. to 425° C., to remove at least a part of the sealing layer.

摘要翻译： 一种半导体器件的制造方法，包括：将半导体用密封组合物涂布在半导体基板上的工序，在绝缘层的绝缘层的凹部的至少底面和侧面形成半导体用密封层 层，密封组合物包含阳离子官能团和重均分子量为2,000〜1,000,000的聚合物，密封组合物中钠的含量和钾含量在元素上为10ppb以下 基础; 以及将形成有密封层的一侧的半导体衬底的表面进行200〜425℃的热处理，除去至少一部分密封层的工序。