Invention Grant
US09174838B2 Distributed MEMS devices time synchronization methods and system
有权
分布式MEMS器件的时间同步方法和系统
- Patent Title: Distributed MEMS devices time synchronization methods and system
- Patent Title (中): 分布式MEMS器件的时间同步方法和系统
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Application No.: US14102465Application Date: 2013-12-10
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Publication No.: US09174838B2Publication Date: 2015-11-03
- Inventor: Wenhua Zhang , Shingo Yoneoka
- Applicant: mCube Inc.
- Applicant Address: US CA San Jose
- Assignee: mCube Inc.
- Current Assignee: mCube Inc.
- Current Assignee Address: US CA San Jose
- Agency: Kilpatrick Townsend and Stockton LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C1/00 ; H01L41/113
Abstract:
A method for fabricating a multiple MEMS device. A semiconductor substrate having a first and second MEMS device, and an encapsulation wafer with a first cavity and a second cavity, which includes at least one channel, can be provided. The first MEMS can be encapsulated within the first cavity and the second MEMS device can be encapsulated within the second cavity. These devices can be encapsulated within a provided first encapsulation environment at a first air pressure, encapsulating the first MEMS device within the first cavity at the first air pressure. The second MEMS device within the second cavity can then be subjected to a provided second encapsulating environment at a second air pressure via the channel of the second cavity.
Public/Granted literature
- US20140227816A1 METHOD TO PACKAGE MULTIPLE MEMS SENSORS AND ACTUATORS AT DIFFERENT GASES AND CAVITY PRESSURES Public/Granted day:2014-08-14
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