Invention Grant
- Patent Title: Resin composition and method for producing circuit board
- Patent Title (中): 树脂组合物及其制造方法
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Application No.: US14496709Application Date: 2014-09-25
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Publication No.: US09175151B2Publication Date: 2015-11-03
- Inventor: Yuko Konno , Hiromitsu Takashita , Tsuyoshi Takeda , Hiroaki Fujiwara , Shingo Yoshioka
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-114652 20110523
- Main IPC: C08K5/34
- IPC: C08K5/34 ; H05K1/03 ; H05K3/00 ; C09D125/08 ; C09D133/08 ; C08K5/3475 ; H05K3/10 ; H05K3/18 ; C08L33/02 ; C08K5/00

Abstract:
The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).
Public/Granted literature
- US20150008379A1 RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD Public/Granted day:2015-01-08
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