公开(公告)号：US09175151B2

公开(公告)日：2015-11-03

申请号：US14496709

申请日：2014-09-25

Applicant: PANASONIC CORPORATION

Inventor： Yuko Konno ,  Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Hiroaki Fujiwara ,  Shingo Yoshioka

IPC: C08K5/34 ,  H05K1/03 ,  H05K3/00 ,  C09D125/08 ,  C09D133/08 ,  C08K5/3475 ,  H05K3/10 ,  H05K3/18 ,  C08L33/02 ,  C08K5/00

CPC classification number: C08K5/3475 ,  C08K5/005 ,  C08L33/02 ,  C09D125/08 ,  C09D133/08 ,  H05K1/0353 ,  H05K3/0014 ,  H05K3/0026 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/184 ,  H05K2201/0112 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/0264 ,  H05K2203/0565 ,  H05K2203/0571

Abstract: The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).

Abstract translation: 本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 使用的树脂组合物是树脂组合物，当∈1表示通过将溶剂中溶解在树脂组合物形成的树脂膜2中制备的溶液中的树脂膜2的每单位重量的吸光度系数作为 在要照射树脂膜2的光波长处的液体，∈1为至少0.01（L /（g·cm））。

公开(公告)号：US09204530B2

公开(公告)日：2015-12-01

申请号：US13869553

申请日：2013-04-24

Applicant: PANASONIC CORPORATION

Inventor： Hiromitsu Takashita ,  Tsuyoshi Takeda ,  Yuko Konno ,  Hiroaki Fujiwara ,  Shingo Yoshioka

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/498 ,  H01L21/56 ,  H05K3/36 ,  H01L25/065 ,  H01L23/00 ,  H01L23/66 ,  H01L25/10 ,  H05K1/11 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K1/0213 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/66 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L25/105 ,  H01L2223/6605 ,  H01L2224/02311 ,  H01L2224/0235 ,  H01L2224/0237 ,  H01L2224/02375 ,  H01L2224/02379 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05548 ,  H01L2224/05553 ,  H01L2224/05564 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/131 ,  H01L2224/16104 ,  H01L2224/16105 ,  H01L2224/16112 ,  H01L2224/16113 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/16238 ,  H01L2224/2741 ,  H01L2224/27436 ,  H01L2224/291 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/32104 ,  H01L2224/32105 ,  H01L2224/32147 ,  H01L2224/32148 ,  H01L2224/32227 ,  H01L2224/32237 ,  H01L2224/32238 ,  H01L2224/81801 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83801 ,  H01L2224/83851 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/10157 ,  H01L2924/12042 ,  H01L2924/30111 ,  H01L2924/381 ,  H01L2924/3841 ,  H05K1/112 ,  H05K1/114 ,  H05K3/323 ,  H05K3/368 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/09045 ,  H05K2201/09227 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/09381 ,  H05K2201/09427 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2924/00

Abstract: The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.

Abstract translation: 本发明涉及将电子部件彼此电连接的电子部件组件，其中形成在第一电子部件的表面上的布线和形成在第二电子部件的表面上的布线彼此面对，并且被接合到每个 另一个电导体插入其间，以便电连接第一电子部件和第二电子部件。 电导体是含有焊料或导电填料的树脂组合物。