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公开(公告)号：US09175151B2
公开(公告)日：2015-11-03
申请号：US14496709
申请日：2014-09-25
IPC分类号： C08K5/34 , H05K1/03 , H05K3/00 , C09D125/08 , C09D133/08 , C08K5/3475 , H05K3/10 , H05K3/18 , C08L33/02 , C08K5/00
CPC分类号： C08K5/3475 , C08K5/005 , C08L33/02 , C09D125/08 , C09D133/08 , H05K1/0353 , H05K3/0014 , H05K3/0026 , H05K3/0032 , H05K3/107 , H05K3/184 , H05K2201/0112 , H05K2201/0209 , H05K2201/0239 , H05K2203/0264 , H05K2203/0565 , H05K2203/0571
摘要： The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film 2 in a solution prepared by dissolving, in a solvent, the resin film 2 formed by application of the resin composition as a liquid, ∈1 at a light wavelength at which the resin film 2 is to be irradiated is at least 0.01 (L/(g·cm)).
摘要翻译： 本发明涉及一种树脂组合物，其包含由含有至少一个羧基的单体单元的第一单体和可与第一单体共聚的第二单体组成的共聚物，并且还包括紫外线吸收剂。 使用的树脂组合物是树脂组合物，当∈1表示通过将溶剂中溶解在树脂组合物形成的树脂膜2中制备的溶液中的树脂膜2的每单位重量的吸光度系数作为 在要照射树脂膜2的光波长处的液体，∈1为至少0.01（L /（g·cm））。
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公开(公告)号：US09332642B2
公开(公告)日：2016-05-03
申请号：US14481188
申请日：2014-09-09
CPC分类号： H05K1/119 , H01L2224/81385 , H05K1/0284 , H05K1/0373 , H05K1/111 , H05K3/0014 , H05K3/0032 , H05K3/0044 , H05K3/0076 , H05K3/0079 , H05K3/0085 , H05K3/107 , H05K3/185 , H05K3/4007 , H05K2201/0209 , H05K2201/0224 , H05K2201/0233 , H05K2201/0239 , H05K2201/0376 , H05K2201/0769 , H05K2201/09227 , H05K2201/09472 , H05K2201/09736 , H05K2201/09745 , H05K2201/098 , H05K2201/09972 , H05K2203/0108 , H05K2203/013 , H05K2203/0143 , H05K2203/0228 , H05K2203/0264 , H05K2203/0285 , H05K2203/0565 , H05K2203/0706 , H05K2203/0776 , H05K2203/1163 , Y02P70/611
摘要： One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate.
摘要翻译： 本发明的一个方面涉及一种包括绝缘基底的电路板; 以及电路层，其由导体形成，并且设置在所述绝缘基底基板的表面上，其中所述绝缘基底具有表面粗糙度Ra为0.5μm以下的平滑表面，并且所述导体至少部分地 嵌入形成在绝缘性基板的表面的布线槽。
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公开(公告)号：US09070393B2
公开(公告)日：2015-06-30
申请号：US14196363
申请日：2014-03-04
IPC分类号： H01L23/04 , G11B5/48 , H01L23/00 , H01L25/065 , H01L25/00 , H05K1/11 , H05K1/18 , H05K3/18 , H01L23/498 , H01L21/48 , H01L21/66 , H01L23/31 , H01L21/56 , H01L23/14
CPC分类号： G11B5/486 , H01L21/4846 , H01L21/565 , H01L22/12 , H01L23/145 , H01L23/3121 , H01L23/49866 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/83 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/05554 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/24011 , H01L2224/2405 , H01L2224/24051 , H01L2224/24137 , H01L2224/24146 , H01L2224/24226 , H01L2224/245 , H01L2224/25175 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73267 , H01L2224/82009 , H01L2224/82039 , H01L2224/82101 , H01L2224/82385 , H01L2224/82399 , H01L2224/82931 , H01L2224/82947 , H01L2224/8385 , H01L2224/85 , H01L2224/92244 , H01L2225/06524 , H01L2225/06551 , H01L2225/06565 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/15798 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/386 , H01L2924/3862 , H05K1/111 , H05K1/181 , H05K3/184 , H05K2201/0376 , H05K2201/09472 , H05K2203/1461 , Y02P70/611 , H01L2924/00012 , H01L2924/00 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： One aspect of the present invention is a three-dimensional structure in which a wiring is formed on a surface, the three-dimensional structure having an insulating resin layer that contains a filler formed from at least one element selected from typical non-metal elements and typical metal elements, wherein a recessed gutter for wiring is formed on a surface of the insulating resin layer, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring.
摘要翻译： 本发明的一个方面是一种三维结构，其中在表面上形成布线，所述三维结构具有绝缘树脂层，所述绝缘树脂层含有由选自典型非金属元素中的至少一种元素形成的填料和 典型的金属元件，其中在绝缘树脂层的表面上形成用于布线的凹槽，并且布线导体的至少一部分嵌入到凹槽中用于布线。
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4.发明申请MANUFACTURING METHOD FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR DEVICE 有权半导体封装，半导体封装和半导体器件的制造方法公开(公告)号：US20140191406A1
公开(公告)日：2014-07-10
申请号：US14235766
申请日：2012-10-18
IPC分类号： H01L21/768 , H01L23/48 , H01L21/56
CPC分类号： H01L21/76877 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L23/481 , H01L23/49816 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/96 , H01L24/97 , H01L2224/02311 , H01L2224/0236 , H01L2224/02379 , H01L2224/033 , H01L2224/03464 , H01L2224/0347 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2224/13022 , H01L2224/13023 , H01L2224/13024 , H01L2224/131 , H01L2224/1411 , H01L2224/19 , H01L2224/2101 , H01L2224/2105 , H01L2224/96 , H01L2924/0001 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/18162 , H01L2924/3511 , H01L2924/014 , H01L2224/13099 , H01L2924/00012 , H01L2224/03 , H01L2224/11 , H01L2924/00
摘要： One aspect of the present invention resides in a manufacturing method for a semiconductor package, including a covering step of forming a covering insulating layer that covers the surface of a semiconductor element, a film-forming step of forming a resin film on the surface of the covering insulating layer, a circuit pattern-forming step of forming a circuit pattern portion including recesses reaching the surfaces of electrodes of the semiconductor element and a circuit groove having a desired shape and a desired depth, a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on the surface of the circuit pattern portion, a film-separating step of separating the resin film from the covering insulating layer, and a plating processing step of forming a circuit electrically connected to the electrodes, by applying electroless plating to the covering insulating layer, from which the resin film is separated.
摘要翻译： 本发明的一个方面在于一种半导体封装的制造方法，包括形成覆盖半导体元件表面的覆盖绝缘层的覆盖步骤，在该表面上形成树脂膜的成膜步骤 覆盖绝缘层的电路图案形成步骤，形成包括到达半导体元件的电极表面的凹部的电路图案部分和具有期望形状和期望深度的电路槽的电路图案形成步骤，沉积镀催化剂的催化剂沉积步骤 或其前体在电路图案部分的表面上，将分离树脂膜与覆盖绝缘层分离的膜分离步骤，以及电镀处理步骤，形成电连接到电极的电路，通过将化学镀施加到 覆盖绝缘层，树脂膜从中分离。
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公开(公告)号：US09669567B2
公开(公告)日：2017-06-06
申请号：US14446660
申请日：2014-07-30
IPC分类号： H01L21/768 , B29C41/20 , B32B37/12 , H01L23/00 , B29K101/00 , B29C39/10 , H01L21/56 , H01L23/31
CPC分类号： B29C41/20 , B29C39/10 , B29K2101/00 , B32B37/12 , H01L21/561 , H01L21/568 , H01L23/3128 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/12105 , H01L2924/12042 , H01L2924/3511 , H01L2924/00
摘要： The present invention relates to a manufacturing method of a molded article, including: a molded article forming step of forming a molded article by curing a resin composition on a main surface, on the side of a bendable first supporting medium, of a laminated supporting medium obtained by laminating the first supporting medium and a second supporting medium that is harder than the first supporting medium; a second-supporting medium peeling step of peeling the second supporting medium from the first supporting medium after the molded article forming step; and a first-supporting medium peeling step of peeling the first supporting medium from the molded article while bending the first supporting medium after the second-supporting medium peeling step. The shape of the first supporting medium can be maintained at a curing temperature at which the resin composition is cured in the molded article forming step.
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公开(公告)号：US09351402B2
公开(公告)日：2016-05-24
申请号：US14554334
申请日：2014-11-26
CPC分类号： H05K1/111 , H01L21/4846 , H01L23/49811 , H01L24/16 , H01L24/81 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/82385 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H05K3/107 , H05K3/184 , H05K3/38 , H05K2201/0373 , H05K2201/0391 , H05K2201/09736 , H05K2201/2072 , H05K2203/0307 , H05K2203/0565 , Y02P70/611 , Y10T29/49155 , H01L2924/00
摘要： A circuit board includes an electric circuit having a wiring section and a pad section in the surface of an insulating base substrate. The electric circuit is configured such that a conductor is embedded in a circuit recess formed in the surface of the insulating base substrate, and the surface roughness of the conductor is different in the wiring section and the pad section of the electric circuit. In this case, it is preferable that the surface roughness of the conductor in the pad section is greater than the surface roughness of the conductor in the wiring section.
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公开(公告)号：US09204530B2
公开(公告)日：2015-12-01
申请号：US13869553
申请日：2013-04-24
IPC分类号： H05K7/00 , H05K1/02 , H01L23/498 , H01L21/56 , H05K3/36 , H01L25/065 , H01L23/00 , H01L23/66 , H01L25/10 , H05K1/11 , H05K3/32 , H05K3/40
CPC分类号： H05K1/0213 , H01L21/563 , H01L23/49811 , H01L23/66 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L25/0657 , H01L25/105 , H01L2223/6605 , H01L2224/02311 , H01L2224/0235 , H01L2224/0237 , H01L2224/02375 , H01L2224/02379 , H01L2224/02381 , H01L2224/0401 , H01L2224/04026 , H01L2224/05548 , H01L2224/05553 , H01L2224/05564 , H01L2224/05568 , H01L2224/05572 , H01L2224/131 , H01L2224/16104 , H01L2224/16105 , H01L2224/16112 , H01L2224/16113 , H01L2224/16147 , H01L2224/16148 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/16238 , H01L2224/2741 , H01L2224/27436 , H01L2224/291 , H01L2224/2929 , H01L2224/293 , H01L2224/32104 , H01L2224/32105 , H01L2224/32147 , H01L2224/32148 , H01L2224/32227 , H01L2224/32237 , H01L2224/32238 , H01L2224/81801 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83801 , H01L2224/83851 , H01L2225/06513 , H01L2924/00014 , H01L2924/10157 , H01L2924/12042 , H01L2924/30111 , H01L2924/381 , H01L2924/3841 , H05K1/112 , H05K1/114 , H05K3/323 , H05K3/368 , H05K3/4007 , H05K2201/0367 , H05K2201/09045 , H05K2201/09227 , H05K2201/09245 , H05K2201/09263 , H05K2201/09381 , H05K2201/09427 , H01L2924/014 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.
摘要翻译： 本发明涉及将电子部件彼此电连接的电子部件组件，其中形成在第一电子部件的表面上的布线和形成在第二电子部件的表面上的布线彼此面对，并且被接合到每个 另一个电导体插入其间，以便电连接第一电子部件和第二电子部件。 电导体是含有焊料或导电填料的树脂组合物。
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8.发明授权Manufacturing method for semiconductor package, semiconductor package, and semiconductor device 有权半导体封装，半导体封装和半导体器件的制造方法公开(公告)号：US09082825B2
公开(公告)日：2015-07-14
申请号：US14235766
申请日：2012-10-18
IPC分类号： H01L21/00 , H01L21/768 , H01L21/56 , H01L23/31 , H01L23/538 , H01L23/498 , H01L23/48 , H01L23/00
CPC分类号： H01L21/76877 , H01L21/56 , H01L21/561 , H01L21/568 , H01L23/3114 , H01L23/481 , H01L23/49816 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/96 , H01L24/97 , H01L2224/02311 , H01L2224/0236 , H01L2224/02379 , H01L2224/033 , H01L2224/03464 , H01L2224/0347 , H01L2224/0401 , H01L2224/04105 , H01L2224/05548 , H01L2224/12105 , H01L2224/13022 , H01L2224/13023 , H01L2224/13024 , H01L2224/131 , H01L2224/1411 , H01L2224/19 , H01L2224/2101 , H01L2224/2105 , H01L2224/96 , H01L2924/0001 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/18162 , H01L2924/3511 , H01L2924/014 , H01L2224/13099 , H01L2924/00012 , H01L2224/03 , H01L2224/11 , H01L2924/00
摘要： One aspect of the present invention resides in a manufacturing method for a semiconductor package, including a covering step of forming a covering insulating layer that covers the surface of a semiconductor element, a film-forming step of forming a resin film on the surface of the covering insulating layer, a circuit pattern-forming step of forming a circuit pattern portion including recesses reaching the surfaces of electrodes of the semiconductor element and a circuit groove having a desired shape and a desired depth, a catalyst-depositing step of depositing a plating catalyst or a precursor thereof on the surface of the circuit pattern portion, a film-separating step of separating the resin film from the covering insulating layer, and a plating processing step of forming a circuit electrically connected to the electrodes, by applying electroless plating to the covering insulating layer, from which the resin film is separated.
摘要翻译： 本发明的一个方面在于一种半导体封装的制造方法，包括形成覆盖半导体元件表面的覆盖绝缘层的覆盖步骤，在该表面上形成树脂膜的成膜步骤 覆盖绝缘层的电路图案形成步骤，形成包括到达半导体元件的电极表面的凹部的电路图案部分和具有期望形状和期望深度的电路槽的电路图案形成步骤，沉积镀催化剂的催化剂沉积步骤 或其前体在电路图案部分的表面上，将分离树脂膜与覆盖绝缘层分离的膜分离步骤，以及电镀处理步骤，形成电连接到电极的电路，通过将化学镀施加到 覆盖绝缘层，树脂膜从中分离。
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公开(公告)号：US09082438B2
公开(公告)日：2015-07-14
申请号：US14196370
申请日：2014-03-04
IPC分类号： H01L23/48 , G11B5/48 , H01L23/00 , H01L25/065 , H01L25/00 , H05K1/11 , H05K1/18 , H05K3/18 , H01L21/66 , H01L23/31 , H01L21/56
CPC分类号： G11B5/486 , H01L21/565 , H01L22/12 , H01L23/3121 , H01L24/24 , H01L24/25 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/82 , H01L24/83 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2224/05554 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/24011 , H01L2224/2402 , H01L2224/2405 , H01L2224/24051 , H01L2224/241 , H01L2224/24137 , H01L2224/24146 , H01L2224/24226 , H01L2224/245 , H01L2224/25175 , H01L2224/32225 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/73267 , H01L2224/82009 , H01L2224/82039 , H01L2224/82101 , H01L2224/82105 , H01L2224/82931 , H01L2224/82947 , H01L2224/8385 , H01L2224/85 , H01L2224/92244 , H01L2225/06524 , H01L2225/06551 , H01L2225/06565 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12041 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1461 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/386 , H01L2924/3862 , H05K1/111 , H05K1/181 , H05K3/184 , H05K2201/0376 , H05K2201/09472 , H05K2203/1461 , Y02P70/611 , H01L2924/00012 , H01L2924/00 , H01L2224/82102 , H01L2224/8284 , H01L2224/0401 , H01L2224/45015 , H01L2924/207
摘要： One aspect of the present invention is a three-dimensional structure that has a concave-convex form including a gutter for wiring having at least partially a width of 20 μm or less, wherein at least a part of a wiring conductor is embedded in the gutter for wiring, and a wiring that extends in such a manner as to creep along the concave-convex form is provided.
摘要翻译： 本发明的一个方面是具有凹凸形状的三维结构，该凹凸形状包括具有至少部分宽度为20μm或更小的布线的布线槽，其中布线导体的至少一部分嵌入沟槽 并且布线以沿凹凸形状蠕动的方式延伸。
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