Invention Grant
- Patent Title: Active probe card for electrical wafer sort of integrated circuits
- Patent Title (中): 用于电子晶圆的主动探针卡集成电路
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Application No.: US13558210Application Date: 2012-07-25
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Publication No.: US09176185B2Publication Date: 2015-11-03
- Inventor: Roberto Canegallo , Mauro Scandiuzzo , Roberto Cardu , Eleonora Franchi Scarselli , Alberto Pagani
- Applicant: Roberto Canegallo , Mauro Scandiuzzo , Roberto Cardu , Eleonora Franchi Scarselli , Alberto Pagani
- Applicant Address: IT Agrate Brianza
- Assignee: STMicroelectronics S.r.l.
- Current Assignee: STMicroelectronics S.r.l.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group PLLC
- Priority: ITMI2011A1415 20110728
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R31/20 ; G01R31/28 ; G01R31/302

Abstract:
A testing apparatus includes a tester and a probe card system that includes a probe card connected to the tester, and an active interposer connected to the probe card and wirelessly coupled with a device to be tested. The active interposer includes pads positioned on its free surface facing the device. The pads are positioned with respect to pads of the device so that each pad of the active interposer faces a pad of the device and is separated therefrom by a dielectric. Each pair of facing pads forms an elementary wireless coupling element which allows a wireless transmission between the active interposer and the device. The active interposer also includes an amplifier circuit configured to amplify wireless signals from the device before forwarding them to the tester. The probe card system includes a transmission element able to transmit a power voltage from the tester to the device.
Public/Granted literature
- US20130027071A1 ACTIVE PROBE CARD FOR ELECTRICAL WAFER SORT OF INTEGRATED CIRCUITS Public/Granted day:2013-01-31
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