Invention Grant
- Patent Title: Connector assembly for an electronic device
- Patent Title (中): 电子设备的连接器组件
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Application No.: US13839448Application Date: 2013-03-15
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Publication No.: US09176537B2Publication Date: 2015-11-03
- Inventor: Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Phil Houdek , Stanislav Moiseyenko , Nathan Jauvtis
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Patent Capital Group
- Main IPC: H01R13/627
- IPC: H01R13/627 ; G06F1/16

Abstract:
Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
Public/Granted literature
- US20140273590A1 CONNECTOR ASSEMBLY FOR AN ELECTRONIC DEVICE Public/Granted day:2014-09-18
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