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公开(公告)号：US10571976B2
公开(公告)日：2020-02-25
申请号：US15405985
申请日：2017-01-13
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Philip J. Houdek, II , Stanislav Moiseyenko , Nathan Isaiah Jauvtis
Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
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公开(公告)号：US10177801B2
公开(公告)日：2019-01-08
申请号：US14757983
申请日：2015-12-26
Applicant: Intel Corporation
Inventor： David M. Collins , Douglas Satzger , Michael A. Hyde
IPC: H04B1/3888
Abstract: A flip device case for an electronic device is described herein. The flip device case includes a recess and a border. The recess is to receive the electronic device via an opening in the recess. The border is to be coupled with the recess and includes a plurality of flexible points. Manipulation of the border at one or more of the flexible points is to configure the flip device case in a position.
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公开(公告)号：USD824384S1
公开(公告)日：2018-07-31
申请号：US29550448
申请日：2016-01-04
Applicant: INTEL CORPORATION
Designer： Aleksander Magi , David M. Collins , Yishan Chang , Nicholas W. Oakley , Randall W. Martin , Douglas Satzger
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公开(公告)号：US20170131746A1
公开(公告)日：2017-05-11
申请号：US15414806
申请日：2017-01-25
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Philip J. Houdek, II , Stanislav Moiseyenko , Nathan Isaiah Jauvtis
CPC classification number: G06F1/1681 , E05D7/00 , E05D11/0081 , E05Y2900/606 , G06F1/1616 , G06F1/1633 , G06F1/1637 , G06F1/1656 , G06F1/1662 , G06F1/1669 , G06F1/1679 , G06F1/1683 , G06F1/189 , G06F21/31 , H01R24/58 , H01R43/16 , H01R2107/00
Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
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公开(公告)号：US09244496B2
公开(公告)日：2016-01-26
申请号：US13976381
申请日：2012-11-28
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Phil Houdek , Stanislav Moiseyenko , Nathan Jauvtis
IPC: G06F1/16
CPC classification number: G06F1/1683 , E05D3/122 , E05D15/50 , G06F1/1616 , G06F1/1632 , G06F1/1637 , G06F1/1654 , G06F1/1662 , G06F1/1681 , Y10T16/528 , Y10T16/541
Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a hinge assembly to secure a top portion of the electronic device to an accessory. The hinge assembly is to allow a rotation of the top portion in relation to the accessory. The hinge assembly may include a plurality of discs to receive a plurality of segments of the accessory as the hinge assembly engages to secure the top portion of the electronic device to the accessory.
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Patent Agency Ranking
公开(公告)号：USD864944S1
公开(公告)日：2019-10-29
申请号：US29643598
申请日：2018-04-10
Applicant: Intel Corporation
Designer： Douglas Satzger , Markus Diebel , Erik Eisermann Guerra , Joe Tan
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公开(公告)号：USD840392S1
公开(公告)日：2019-02-12
申请号：US29513137
申请日：2014-12-27
Applicant: Intel Corporation
Designer： Douglas Satzger , Sameer Sharma , Gadi Amit , Yoshikazu Hoshino
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公开(公告)号：US20170131745A1
公开(公告)日：2017-05-11
申请号：US15414765
申请日：2017-01-25
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Philip J. Houdek, II , Stanislav Moiseyenko , Nathan Isaiah Jauvtis
IPC: G06F1/16
CPC classification number: G06F1/1681 , E05D7/00 , E05D11/0081 , E05Y2900/606 , G06F1/1616 , G06F1/1633 , G06F1/1637 , G06F1/1656 , G06F1/1662 , G06F1/1669 , G06F1/1679 , G06F1/1683 , G06F1/189 , G06F21/31 , H01R24/58 , H01R43/16 , H01R2107/00
Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
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公开(公告)号：USD771034S1
公开(公告)日：2016-11-08
申请号：US29531727
申请日：2015-06-29
Applicant: Intel Corporation
Designer： Douglas Satzger , David M. Collins , Gadi Amit , Yoshikazu Hoshino , Maura Hoven , Jinwoo Kim , Luke D. Mastrangelo , Kebei Li
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公开(公告)号：USD761786S1
公开(公告)日：2016-07-19
申请号：US29464888
申请日：2013-08-21
Applicant: INTEL CORPORATION
Designer： Douglas Satzger , Sameer Sharma , Gadi Amit , Yoshikazu Hoshino
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