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公开(公告)号：US11693453B2
公开(公告)日：2023-07-04
申请号：US17012508
申请日：2020-09-04
Applicant: Intel Corporation
Inventor： Sameer Sharma , Gadi Amit , Yoshikuzu Hoshino , Chadwick Harber , Daniel Clifton , Kenneth Jasinski
IPC: G06F1/16 , G06F3/04817 , G06F3/04842
CPC classification number: G06F1/1681 , G06F1/1626 , G06F1/1632 , G06F1/1666 , G06F3/04817 , G06F3/04842 , G06F2200/1634
Abstract: Embodiments of an apparatus and system are described for a hybrid computing device. Some embodiments may comprise a computing device having an enclosure arranged to support a display on a front of the enclosure and a cover mechanically coupled to a side of the enclosure, the cover comprising a first portion having at least one integrated input device and a second portion having at least one flexible seam arranged to allow the second portion to adjustably pivot around the seam. Other embodiments are described and claimed.
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公开(公告)号：USD840392S1
公开(公告)日：2019-02-12
申请号：US29513137
申请日：2014-12-27
Applicant: Intel Corporation
Designer： Douglas Satzger , Sameer Sharma , Gadi Amit , Yoshikazu Hoshino
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公开(公告)号：US20170131745A1
公开(公告)日：2017-05-11
申请号：US15414765
申请日：2017-01-25
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Philip J. Houdek, II , Stanislav Moiseyenko , Nathan Isaiah Jauvtis
IPC: G06F1/16
CPC classification number: G06F1/1681 , E05D7/00 , E05D11/0081 , E05Y2900/606 , G06F1/1616 , G06F1/1633 , G06F1/1637 , G06F1/1656 , G06F1/1662 , G06F1/1669 , G06F1/1679 , G06F1/1683 , G06F1/189 , G06F21/31 , H01R24/58 , H01R43/16 , H01R2107/00
Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
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公开(公告)号：USD771034S1
公开(公告)日：2016-11-08
申请号：US29531727
申请日：2015-06-29
Applicant: Intel Corporation
Designer： Douglas Satzger , David M. Collins , Gadi Amit , Yoshikazu Hoshino , Maura Hoven , Jinwoo Kim , Luke D. Mastrangelo , Kebei Li
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公开(公告)号：USD761786S1
公开(公告)日：2016-07-19
申请号：US29464888
申请日：2013-08-21
Applicant: INTEL CORPORATION
Designer： Douglas Satzger , Sameer Sharma , Gadi Amit , Yoshikazu Hoshino
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Patent Agency Ranking
公开(公告)号：US09176537B2
公开(公告)日：2015-11-03
申请号：US13839448
申请日：2013-03-15
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Phil Houdek , Stanislav Moiseyenko , Nathan Jauvtis
IPC: H01R13/627 , G06F1/16
CPC classification number: G06F1/1681 , E05D7/00 , E05D11/0081 , E05Y2900/606 , G06F1/1616 , G06F1/1633 , G06F1/1637 , G06F1/1656 , G06F1/1662 , G06F1/1669 , G06F1/1679 , G06F1/1683 , G06F1/189 , G06F21/31 , H01R24/58 , H01R43/16 , H01R2107/00
Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
Abstract translation: 本文描述的特定示例提供了诸如笔记本电脑或笔记本电脑的电子设备，其包括耦合到多个电子组件（其包括任何类型的硬件，元件，电路等）的电路板。 电子设备还可以包括定位在电子设备的凹部的至少一部分内的连接器组件，其中连接器组件包括：第一组件，用于接收连接器; 以及第二组件，其将接收将提供用户和电子设备之间的关联的识别模块。
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公开(公告)号：US10152093B2
公开(公告)日：2018-12-11
申请号：US15414806
申请日：2017-01-25
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Philip J. Houdek, II , Stanislav Moiseyenko , Nathan Isaiah Jauvtis
Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
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公开(公告)号：US20170131740A1
公开(公告)日：2017-05-11
申请号：US15414862
申请日：2017-01-25
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Philip J. Houdek, II , Stanislav Moiseyenko , Nathan Isaiah Jauvtis
IPC: G06F1/16
CPC classification number: G06F1/1681 , E05D7/00 , E05D11/0081 , E05Y2900/606 , G06F1/1616 , G06F1/1633 , G06F1/1637 , G06F1/1656 , G06F1/1662 , G06F1/1669 , G06F1/1679 , G06F1/1683 , G06F1/189 , G06F21/31 , H01R24/58 , H01R43/16 , H01R2107/00
Abstract: Particular examples described herein provide for an electronic device, such as a notebook computer or laptop, which includes a circuit board coupled to a plurality of electronic components (which includes any type of hardware, elements, circuitry, etc.). The electronic device may also include a connector assembly that is positioned within at least a portion of a recess of the electronic device, where the connector assembly includes: a first assembly that is to receive a connector; and a second assembly that is to receive an identification module that is to provide an association between a user and the electronic device.
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公开(公告)号：US09548576B2
公开(公告)日：2017-01-17
申请号：US14930124
申请日：2015-11-02
Applicant: Intel Corporation
Inventor： Sameer Sharma , Douglas Satzger , Gadi Amit , Yoshikazu Hoshino , Chadwick Harber , Daniel Clifton , Philip J. Houdek, II , Stanislav Moiseyenko , Nathan Jauvtis
IPC: H01R24/58 , G06F1/16 , G06F21/31 , H01R43/16 , H01R107/00
CPC classification number: G06F1/1681 , E05D7/00 , E05D11/0081 , E05Y2900/606 , G06F1/1616 , G06F1/1633 , G06F1/1637 , G06F1/1656 , G06F1/1662 , G06F1/1669 , G06F1/1679 , G06F1/1683 , G06F1/189 , G06F21/31 , H01R24/58 , H01R43/16 , H01R2107/00
Abstract: An electronic device includes an audio jack assembly that is to receive an audio input, wherein the audio jack assembly is provided concentrically with a circular recess of the electronic device, wherein the circular recess is within a hinge assembly of the electronic device, and wherein the audio jack assembly is in engagement with the hinge assembly.
Abstract translation: 电子设备包括用于接收音频输入的音频插孔组件，其中所述音频插座组件与所述电子设备的圆形凹槽同心地设置，其中所述圆形凹槽位于所述电子设备的铰链组件内，并且其中 音频插座组件与铰链组件接合。
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公开(公告)号：USD767563S1
公开(公告)日：2016-09-27
申请号：US29501764
申请日：2014-09-08
Applicant: Intel Corporation
Designer： Douglas Satzger , David Collins , Gadi Amit , Yoshikazu Hoshino , Maura Hoven , Jinwoo Kim
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