发明授权
US09177925B2 Apparatus related to an improved package including a semiconductor die
有权
涉及包括半导体管芯的改进封装的装置
- 专利标题： Apparatus related to an improved package including a semiconductor die
- 专利标题（中）： 涉及包括半导体管芯的改进封装的装置
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申请号： US14092485申请日： 2013-11-27
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公开(公告)号： US09177925B2公开(公告)日： 2015-11-03
- 发明人: Ahmad R. Ashrafzadeh , Vijay G. Ullal , Justin Chiang , Daniel Kinzer , Michael M. Dube , Oseob Jeon , Chung-Lin Wu , Maria Cristina Estacio
- 申请人： Fairchild Semiconductor Corporation
- 申请人地址： US CA San Jose
- 专利权人： Fairfchild Semiconductor Corporation
- 当前专利权人： Fairfchild Semiconductor Corporation
- 当前专利权人地址： US CA San Jose
- 代理机构： Brake Hughes Bellermann LLP
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/64 ; H01L23/31 ; H01L23/538 ; H01L23/00 ; H01L25/16 ; H01L23/14 ; H01L23/15
摘要：
In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.
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