发明授权
- 专利标题: Semiconductor device and method for manufacturing same
- 专利标题(中): 半导体装置及其制造方法
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申请号: US13790282申请日: 2013-03-08
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公开(公告)号: US09184229B2公开(公告)日: 2015-11-10
- 发明人: Chiharu Ota , Johji Nishio , Kazuto Takao , Takashi Shinohe
- 申请人: Kabushiki Kaisha Toshiba
- 申请人地址: JP Tokyo
- 专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人: Kabushiki Kaisha Toshiba
- 当前专利权人地址: JP Tokyo
- 代理机构: Oblon, McClelland, Maier & Neustadt, L.L.P.
- 优先权: JP2012-170278 20120731
- 主分类号: H01L29/792
- IPC分类号: H01L29/792 ; H01L29/15 ; H01L29/06 ; H01L21/02 ; H01L29/872 ; H01L29/66 ; H01L29/739 ; H01L29/78 ; H01L29/861 ; H01L29/161 ; H01L29/165 ; H01L29/167 ; H01L29/16
摘要:
According to one embodiment, a semiconductor device, includes: a first semiconductor region of a first conductivity type; a second semiconductor region provided on the first semiconductor region, an impurity concentration of the second semiconductor region being lower than an impurity concentration of the first semiconductor region; a third semiconductor region of a second conductivity type provided on the second semiconductor region; and a fourth semiconductor region provided on the third semiconductor region or in a portion of the third semiconductor region. A lattice strain of the fourth semiconductor region is greater than a lattice strain of the third semiconductor region.
公开/授权文献
- US20140034965A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 公开/授权日:2014-02-06
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