发明授权
US09196753B2 Select devices including a semiconductive stack having a semiconductive material
有权
选择包括具有半导体材料的半导体叠层的器件
- 专利标题: Select devices including a semiconductive stack having a semiconductive material
- 专利标题(中): 选择包括具有半导体材料的半导体叠层的器件
-
申请号: US13089648申请日: 2011-04-19
-
公开(公告)号: US09196753B2公开(公告)日: 2015-11-24
- 发明人: D. V. Nirmal Ramaswamy , Gurtej Sandhu
- 申请人: D. V. Nirmal Ramaswamy , Gurtej Sandhu
- 申请人地址: US ID Boise
- 专利权人: Micron Technology, Inc.
- 当前专利权人: Micron Technology, Inc.
- 当前专利权人地址: US ID Boise
- 代理机构: Brooks, Cameron & Huebsch, PLLC
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H01L29/872 ; H01L27/28 ; H01L45/00 ; H01L27/102 ; H01L29/885 ; H01L27/22 ; H01L27/24 ; G11C11/56 ; G11C13/00
摘要:
Methods, devices, and systems are provided for a select device that can include a semiconductive stack of at least one semiconductive material formed on a first electrode, where the semiconductive stack can have a thickness of about 700 angstroms (Å) or less. Each of the at least one semiconductive material can have an associated band gap of about 4 electron volts (eV) or less and a second electrode can be formed on the semiconductive stack.
公开/授权文献
信息查询
IPC分类: