Invention Grant
- Patent Title: Solder material and bonded structure
- Patent Title (中): 焊料和粘结结构
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Application No.: US14551007Application Date: 2014-11-23
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Publication No.: US09199340B2Publication Date: 2015-12-01
- Inventor: Akio Furusawa , Kiyohiro Hine , Masato Mori , Taichi Nakamura
- Applicant: Panasonic Intellectual Property Management Co., Ltd.
- Applicant Address: JP Osaka
- Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee: Panasonic Intellectual Property Management Co., Ltd.
- Current Assignee Address: JP Osaka
- Agency: Panasonic Patent Center
- Priority: JP2013-245191 20131127
- Main IPC: B23K35/26
- IPC: B23K35/26 ; H05K1/11 ; B23K35/40 ; B23K35/02 ; H05K3/34 ; H05K3/24
Abstract:
Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0
Public/Granted literature
- US20150144388A1 SOLDER MATERIAL AND BONDED STRUCTURE Public/Granted day:2015-05-28
Information query
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