-
公开(公告)号：US08957521B2
公开(公告)日：2015-02-17
申请号：US14114337
申请日：2012-12-26
Inventor： Taichi Nakamura , Hidetoshi Kitaura
IPC: H01L23/12 , H01L23/52 , H01L29/40 , H01L23/00 , B23K35/02 , B23K35/22 , H01L23/488 , H01L23/492 , B23K35/26 , B23K35/30 , H01L23/495
CPC classification number: H01L24/05 , B23K35/0261 , B23K35/0272 , B23K35/22 , B23K35/264 , B23K35/302 , H01L23/488 , H01L23/492 , H01L23/49513 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/04026 , H01L2224/04042 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/2712 , H01L2224/27334 , H01L2224/29083 , H01L2224/29111 , H01L2224/29139 , H01L2224/29147 , H01L2224/32245 , H01L2224/32503 , H01L2224/32507 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83065 , H01L2224/83101 , H01L2224/83192 , H01L2224/83201 , H01L2224/83411 , H01L2224/83439 , H01L2224/83444 , H01L2224/83447 , H01L2224/83455 , H01L2224/8381 , H01L2224/83986 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/12042 , H01L2924/203 , H01L2924/3025 , H01L2924/351 , H01L2924/3512 , H01L2924/35121 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2924/01083 , H01L2224/8321 , H01L2924/0002
Abstract: A mounted structure includes an electrode of a substrate, an electrode of a semiconductor element, and a mounted layers for bonding the electrode of the substrate and the electrode of the semiconductor element, and the mounted layers includes: a first intermetallic compound layer containing a CuSn-based intermetallic compound; a Bi layer; a second intermetallic compound layer containing a CuSn-based intermetallic compound; a Cu layer; and a third intermetallic compound layer containing a CuSn-based intermetallic compound, and the above layers are sequentially arranged from the electrode of the substrate toward the electrode of the semiconductor element to configure the mounted layers.
Abstract translation: 安装结构包括基板的电极，半导体元件的电极和用于接合基板的电极和半导体元件的电极的安装层，并且安装的层包括：含有CuSn的第一金属间化合物层 基金属间化合物; 铋层; 包含CuSn基金属间化合物的第二金属间化合物层; 铜层; 以及含有CuSn基金属间化合物的第三金属间化合物层，并且从基板的电极向半导体元件的电极依次配置上述层，以配置安装层。
-
公开(公告)号：US12215448B2
公开(公告)日：2025-02-04
申请号：US17700961
申请日：2022-03-22
Inventor： Taichi Nakamura , Norihito Tsukahara , Kouji Ikeda
Abstract: A fiber assembly includes a support sheet, a warp yarn group in which warp yarns including a polymer material are arranged, and a weft yarn group in which weft yarns including a polymer material are arranged. A surface of the support sheet has been subjected to a release treatment. The warp yarn group and the weft yarn group are on the surface of the support sheet. The warp yarn group and the weft yarn group define contact portion regions and non-contact portion regions. In each of the contact portion regions, one of the warp yarns is integrated with one of the weft yarns. Each of the warp yarns and the weft yarns has a line width of 1 μm to 10 μm, inclusive. One of the contact portion regions has a fiber density which is higher than a fiber density of one of the non-contact portion regions.
-
3.发明授权公开(公告)号：US11012007B2
公开(公告)日：2021-05-18
申请号：US16460145
申请日：2019-07-02
Inventor： Taichi Nakamura , Kazuki Sakai
Abstract: Provided herein is a magnetostriction element having a large power output and a high power density. The magnetostriction element is comprised of a magnetostrictive material that is a monocrystalline alloy represented by the following formula (1), Fe(100-α-β)GaαXβ, Formula (1) wherein α and β represent the Ga content (at %) and the X content (at %), respectively, X is at least one element selected from the group consisting of Sm, Eu, Gd, Tb, Dy, Cu, and C, and the formula satisfies 5≤α≤40, and 0≤β≤1.
-
公开(公告)号：US11008642B2
公开(公告)日：2021-05-18
申请号：US16275225
申请日：2019-02-13
Inventor： Kazuki Sakai , Taichi Nakamura , Ryou Kuwabara
Abstract: A magnetostrictive material includes a FeGaBa alloy that is represented by Expression (1), Fe(100-x-y)GaxBay (1) (in Expression (1), x and y are respectively a content rate (at. %) of Ga and a content rate (at. %) of Ba, and satisfy that y≤0.012x−0.168, y≤−0.05x+1.01, and y≥−0.04/7x+0.87/7).
-
公开(公告)号：US10464286B2
公开(公告)日：2019-11-05
申请号：US15352739
申请日：2016-11-16
Inventor： Taichi Nakamura , Takayoshi Yamaguchi , Koji Motomura
Abstract: A laminated nonwoven fabric includes first to third nonwoven fabrics and an adhesive sandwiched between at least the second nonwoven fabric and the third nonwoven fabric. The second nonwoven fabric contains second fibers and is laminated on the first nonwoven fabric containing first fibers, and the third nonwoven fabric contains third fibers and is laminated on the second nonwoven fabric on an opposite side to the first nonwoven fabric. An average fiber diameter of the first fibers is larger than that of the second fibers. The second nonwoven fabric has first and second regions which exist mixedly with each other, and a density of the second fibers in the second region is lower than that in the first region. A part of the adhesive is present between a portion of the first nonwoven and a portion of the third nonwoven fabric which face the second region.
-
Patent Agency Ranking
公开(公告)号：US11309485B2
公开(公告)日：2022-04-19
申请号：US16275235
申请日：2019-02-13
Inventor： Takehiro Tanaka , Kazuki Sakai , Taichi Nakamura , Ryou Kuwabara
Abstract: A magnetostrictive material includes a FeGaSm alloy that is represented by Expression (1), Fe(100-x-y)GaxSmy (1) (in Expression (1), x and y are respectively a content rate (at. %) of Ga and a content rate (at. %) of Sm, and satisfy that y≤0.35x−4.2, y≤−x+20.1, and y≥−0.1x+2.1).
-
公开(公告)号：US11186818B2
公开(公告)日：2021-11-30
申请号：US15901993
申请日：2018-02-22
Inventor： Kouji Ikeda , Taichi Nakamura
Abstract: Provided is a culture medium including fibers aligned in one direction, and a method for producing the same. The culture medium includes: a substrate; a frame body that includes a first surface, a second surface opposite therefrom, and one or more through holes extending from the first surface through the second surface, and that is mounted to the substrate such that the first surface is opposed thereto; a plurality of aligned fibers interposed between the substrate and the first surface; and a bonding portion that bonds the substrate, the plurality of aligned fibers, and the frame body, wherein at least a part of the plurality of aligned fibers is exposed from a first opening that is formed in the first surface by the through hole.
-
8.发明授权公开(公告)号：US10173158B2
公开(公告)日：2019-01-08
申请号：US15167820
申请日：2016-05-27
Inventor： Koji Motomura , Hiroto Sumida , Takahiro Kurokawa , Taichi Nakamura , Takayoshi Yamaguchi , Takatoshi Mitsushima
IPC: B01D39/16 , B32B5/02 , B32B7/12 , B32B5/08 , B32B5/26 , B32B7/02 , B32B7/14 , B32B37/00 , B32B37/24 , B32B37/12
Abstract: A laminated nonwoven fabric includes a first nonwoven fabric and a second nonwoven fabric. The first nonwoven fabric contains charged first fibers. The second nonwoven fabric contains second fibers, and is laminated on the first nonwoven fabric. A fiber diameter of the first fibers is larger than a fiber diameter of the second fibers.
-
公开(公告)号：US09199340B2
公开(公告)日：2015-12-01
申请号：US14551007
申请日：2014-11-23
Inventor： Akio Furusawa , Kiyohiro Hine , Masato Mori , Taichi Nakamura
CPC classification number: B23K35/262 , B23K35/0222 , B23K35/26 , B23K35/40 , C22C13/00 , H05K1/11 , H05K1/111 , H05K1/18 , H05K3/244 , H05K3/3463 , H05K2201/0338 , H05K2201/10909
Abstract: Solder material used in soldering of an Au electrode including Ni plating containing P includes Ag satisfying 0.3≦[Ag]≦4.0, Bi satisfying 0≦[Bi]≦1.0, and Cu satisfying 0≦[Cu]≦1.2, where contents (mass %) of Ag, Bi, Cu and In in the solder material are denoted by [Ag], [Bi], [Cu], and [In], respectively. The solder material includes In in a range of 6.0≦[In]≦6.8 when [Cu] falls within a range of 0
Abstract translation: 用于包含含有含有Ni的Au电极的Au电极的焊接中使用的焊料包括满足0.3＆nlE的Ag; [Ag]＆nlE; 4.0，满足0＆nlE的Bi; [Bi]＆nlE; 1.0，满足0＆nlE的Cu; [Cu] 其中焊料中Ag，Bi，Cu和In的含量（质量％）分别由[Ag]，[Bi]，[Cu]和[In]表示。 当[Cu]在0 <[Cu] <0.5的范围内时，焊料材料包括In的范围为6.0＆nlE; [In]＆nlE; 6.8; In为5.2+（6-（1.55×[Cu 当Cu [Cu]在[Cu]的范围内时，[Cu]和nlE; 1.0，In的范围为5.2＆nlE; [In]＆nlE; 6.8当[Cu] 落在1.0 <[Cu]和nlE的范围内。 余量仅包括不少于87质量％的Sn。
-
公开(公告)号：US11773513B2
公开(公告)日：2023-10-03
申请号：US17660643
申请日：2022-04-26
Inventor： Taichi Nakamura , Norihito Tsukahara , Kouji Ikeda
Abstract: A device for manufacturing a fiber assembly includes: a rotating body that has a cylindrical shape, and winds and holds a plurality of support sheets around an outer peripheral surface around a rotation axis of the rotating body; a plurality of supply nozzles arranged along a direction parallel to the rotation axis, the supply nozzles supplying a polymer material to be a material of fibers to the plurality of support sheets; a supply nozzle moving unit that relatively moves the plurality of supply nozzles in the direction parallel to the rotation axis of the rotating body, in which the rotating body is rotatable about the rotation axis to wind, on main surfaces of the plurality of support sheets, fibers obtained by naturally cooling or naturally drying the polymer material supplied from the plurality of supply nozzles, and the rotating body includes a plurality of guide members in an annular shape circumscribing the outer peripheral surface of the rotating body concentrically to regulate positions of the plurality of support sheets.
-
-
-
-
-
-
-
-
-
Search Results
17
records
(took 0.017 seconds)
