Invention Grant
- Patent Title: Metal laminated structure and method for producing the metal laminated structure
- Patent Title (中): 金属叠层结构及其制造方法
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Application No.: US13381703Application Date: 2010-06-08
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Publication No.: US09199433B2Publication Date: 2015-12-01
- Inventor: Koji Nitta , Masatoshi Majima , Shinji Inazawa , Yugaku Abe , Hiroshi Yokoyama , Osamu Suwata , Shinichi Yamagata
- Applicant: Koji Nitta , Masatoshi Majima , Shinji Inazawa , Yugaku Abe , Hiroshi Yokoyama , Osamu Suwata , Shinichi Yamagata
- Applicant Address: JP Osaka JP Tokyo
- Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.,A.L.M.T. CORP.
- Current Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD.,A.L.M.T. CORP.
- Current Assignee Address: JP Osaka JP Tokyo
- Agency: Ditthavong & Steiner, P.C.
- Priority: JP2009-155159 20090630
- International Application: PCT/JP2010/059695 WO 20100608
- International Announcement: WO2011/001795 WO 20110106
- Main IPC: H01L23/373
- IPC: H01L23/373 ; B32B15/01 ; C23C28/02 ; C25D3/66 ; C25D5/10 ; C25D7/06 ; C25D7/12 ; H01L33/64
Abstract:
There is provided a metal laminated structure comprising a first metal layer, a second metal layer and a third metal layer, the first metal layer being disposed on one surface of the second metal layer, the third metal layer being disposed on the other surface of the second metal layer, the first metal layer including at least one of tungsten and molybdenum, the second metal layer including copper, the third metal layer including at least one of tungsten and molybdenum, and a method for producing the metal laminated structure.
Public/Granted literature
- US20120100392A1 METAL LAMINATED STRUCTURE AND METHOD FOR PRODUCING THE METAL LAMINATED STRUCTURE Public/Granted day:2012-04-26
Information query
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