Invention Grant
- Patent Title: Low profile, surface mount electromagnetic component assembly and methods of manufacture
- Patent Title (中): 薄型,表面贴装电磁元件组装及制造方法
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Application No.: US14314625Application Date: 2014-06-25
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Publication No.: US09202617B2Publication Date: 2015-12-01
- Inventor: Dengyan Zhou , Yipeng Yan , Robert James Bogert , Brent Alan Elliott
- Applicant: COOPER TECHNOLOGIES COMPANY
- Applicant Address: US TX Houston
- Assignee: COOPER TECHNOLOGIES COMPANY
- Current Assignee: COOPER TECHNOLOGIES COMPANY
- Current Assignee Address: US TX Houston
- Agency: Armstrong Teasdale LLP
- Main IPC: H01F17/04
- IPC: H01F17/04 ; H01F27/24 ; H01F27/29 ; H01F7/06 ; H01F27/28 ; H01F27/30 ; H01F41/00

Abstract:
A low profile surface mount electromagnetic component such as a power inductor includes first and second core pieces arranged side by side and having longitudinal side walls facing one another. A preformed coil winding includes vertical legs that are received in vertical slots of the facing longitudinal sidewalls of the component. Inset depressed sections are provided in the top surfaces of the first and second magnetic core pieces and receive a main winding section of the coil winding. Surface mount terminal tabs extend on the bottom surfaces of both the first and second magnetic core pieces.
Public/Granted literature
- US20150009004A1 LOW PROFILE, SURFACE MOUNT ELECTROMAGNETIC COMPONENT ASSEMBLY AND METHODS OF MANUFACTURE Public/Granted day:2015-01-08
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