Invention Grant
- Patent Title: Electronic components assembly
- Patent Title (中): 电子元件装配
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Application No.: US13869553Application Date: 2013-04-24
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Publication No.: US09204530B2Publication Date: 2015-12-01
- Inventor: Hiromitsu Takashita , Tsuyoshi Takeda , Yuko Konno , Hiroaki Fujiwara , Shingo Yoshioka
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC CORPORATION
- Current Assignee: PANASONIC CORPORATION
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2010-238942 20101025
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K1/02 ; H01L23/498 ; H01L21/56 ; H05K3/36 ; H01L25/065 ; H01L23/00 ; H01L23/66 ; H01L25/10 ; H05K1/11 ; H05K3/32 ; H05K3/40
Abstract:
The present invention relates to electronic components assembly for electrically connecting electronic components to each other, wherein a wiring formed on a surface of a first electronic component and a wiring formed on a surface of a second electronic component face each other, and are bonded to each other with an electric conductor interposed therebetween, so as to electrically connect the first electronic component and the second electronic component. The electric conductor is a resin composition containing solder or conductive filler.
Public/Granted literature
- US20130265729A1 ELECTRONIC COMPONENTS ASSEMBLY Public/Granted day:2013-10-10
Information query
