Invention Grant
- Patent Title: Photopolymerizable compositions for electroless plating methods
- Patent Title (中): 用于化学镀方法的光聚合组合物
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Application No.: US14174879Application Date: 2014-02-07
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Publication No.: US09207533B2Publication Date: 2015-12-08
- Inventor: Deepak Shukla , Mark R. Mis
- Applicant: Deepak Shukla , Mark R. Mis
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agent J. Lanny Tucker
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/038 ; G03F7/028

Abstract:
A photopolymerizable composition has seven essential components: (a) a photopolymerizable epoxy material, (b) a photoacid generator such as an onium salt, (c) electron acceptor photosensitizer, (d) an electron donor co-initiator having an oxidation potential of 0.1 V to 3 V vs. SCE, (e) metal particles, and in some embodiments, (f) one or more free radically polymerizable compounds, and (g) one or more free radical photoinitiators. This photopolymerizable composition can be applied or printed onto one or both sides of various substrates to form articles that can be used to form electrically conductive materials. Methods for using the photopolymerizable compositions include electroless plating methods that can be carried out in roll-to-roll printing and plating systems once various photocured patterns are formed from the photopolymerizable compositions.
Public/Granted literature
- US20150227041A1 PHOTOPOLYMERIZABLE COMPOSITIONS FOR ELECTROLESS PLATING METHODS Public/Granted day:2015-08-13
Information query
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