Invention Grant
- Patent Title: Thermal buffering element
- Patent Title (中): 热缓冲元件
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Application No.: US13953742Application Date: 2013-07-30
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Publication No.: US09210832B2Publication Date: 2015-12-08
- Inventor: Kuang-Yu Chang , Ing-Jer Chiou
- Applicant: ASUSTeK COMPUTER INC.
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: CKC & Partners Co., Ltd.
- Priority: CN201310270709 20130701
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; H01L23/427

Abstract:
A thermal buffering element applied to an electronic device is provided. The thermal buffering element includes a heat absorbing material and a plurality of metal particles. The heat absorbing material is disposed corresponding to a heat source of the electronic device. The metal particles are distributed in the heat absorbing material. The invention solves the problem of uneven heat dissipation of an electronic product, which makes a user feel more comfortable.
Public/Granted literature
- US20140043769A1 THERMAL BUFFERING ELEMENT Public/Granted day:2014-02-13
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